Role of dislocations on Sn diffusion during low temperature annealing of GeSn layers

Hryhorii Stanchu, Abdulla Said, Oluwatobi Olorunsola, Sudip Acharya, Sylvester Amoah, Mohammad Zamani-Alavijeh, Fernando M. de Oliveira, Santosh Karki Chhetri, Jin Hu, Yuriy I. Mazur, Shui-Qing Yu, Gregory Salamo
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Abstract

A study of the mechanism of Sn out-diffusion was performed by annealing Ge0.905Sn0.095 layers at 300 °C. The changes in Sn composition and strain state were confirmed by x-ray diffraction and photoluminescence spectroscopy. Surface defects, appearing as Sn particles, with the highest density of 3.5 × 108 cm−2 were detected by atomic force microscopy after annealing for 2 h. The strain in the GeSn layer stabilized for more prolonged annealing, while the density of particles decreased and their size increased. Annealing results are discussed in terms of Sn segregation and subsequent diffusion along dislocation lines, enhanced out-diffusion by dislocations migration, and surface particle coalescence.
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GeSn层低温退火过程中位错对Sn扩散的影响
采用300℃退火ge0.905 - sn0.095合金,研究了Sn向外扩散的机理。通过x射线衍射和光致发光光谱分析证实了锡元素组成和应变状态的变化。退火2 h后,原子力显微镜观察到表面缺陷以Sn粒子的形式出现,其密度最高为3.5 × 108 cm−2。退火时间越长,GeSn层中的应变趋于稳定,而颗粒密度减小,尺寸增大。退火结果从锡偏析和随后沿位错线扩散、位错迁移增强的向外扩散和表面颗粒聚并等方面进行了讨论。
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