Influence of Doped Detonation Nanodiamonds on the Physical and Chemical Properties of Electrochemical Chromium Coatings

Valerii Dolmatov, Galina Konstantinovna Burkat, Maxim Nikolaevich Kiselev
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Abstract

Chromium deposition process regularities are analyzed in the standard chromium plating electrolytes, with and without detonation nanodiamonds additives modified with boron, phosphorus (DND-boron, phosphorus-DND) at a temperature of 50º to 55ºC while stirring the solution and without. It was studied by method of recording the partial polarization curves the concentration effect of additives DND-boron (in the range of 2,5 ÷ 10 g/l) on the kinetics of the chromate ion partial and full reducing. It has been shown that increasing the concentration of DND-boron leads to inhibition of the reaction Cr (VI) → Cr (III) and Cr polarization curves shift reaction (VI) → Cr (0) to a negative potential on the magnitude of 40-70 mV. While stirring the electrolyte chromium deposition occurs at more positive potentials than in quiescent electrolyte. Dependence of the electrode potential on the current density logarithm in all cases are linear with a slope close to 120 mV, indicating a limiting step of attaching the first electron. Mechanism of deposition of chrome in the presence of boron-DND does not change. Shiny, smooth, uniform coatings are deposited in electrolytes with DND-boron additives. Increased polarization in the chromium precipitation of electrolytes with DND-boron causes a change in precipitation structure, and as a consequence an increase in microhardness of chrome coatings from 955 kgf/mm2 for pure chromium to 1430 kgf/mm2 for chromium with embedded DND-boron nanodiamond particles. Wear resistance is increased: using DND-TAN - 2-3 times compared to standard chrome plating, using DND-phosphorus - in 3 times in comparison with DND-TAN, and using DCS (Si), doped silicon, wear is not detected (under the test conditions).
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掺爆轰纳米金刚石对电化学铬镀层理化性能的影响
在标准镀铬电解液中,用硼、磷修饰的纳米金刚石添加剂(DND-boron, phosphorus- dnd)在50 ~ 55℃的温度下搅拌溶液和不搅拌溶液中,分析了铬沉积的过程规律。采用记录部分极化曲线的方法,研究了添加剂dnd -硼(2、5 ~ 10 g/l)浓度对铬酸盐离子部分和完全还原动力学的影响。结果表明,增加dnd -硼浓度可抑制Cr (VI)→Cr (III)反应,使Cr (VI)→Cr(0)反应的极化曲线向负电位移动,幅度为40 ~ 70 mV。当搅拌电解液时,铬沉积发生在比静止电解液中更多的正电位下。在所有情况下,电极电位与电流密度对数的关系都是线性的,斜率接近120mv,表明附着第一个电子的极限步骤。硼- dnd存在时,铬的沉积机理没有改变。有光泽、光滑、均匀的涂层沉积在含有dnd -硼添加剂的电解质中。在含dnd -硼的电解液中析出的铬的极化增加导致了析出结构的变化,从而使铬涂层的显微硬度从纯铬的955 kgf/mm2增加到含dnd -硼纳米金刚石颗粒的铬的1430 kgf/mm2。耐磨性提高:使用DND-TAN - 2-3倍于标准镀铬,使用dnd -磷-3倍于DND-TAN,使用DCS (Si),掺杂硅,未检测到磨损(在测试条件下)。
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