The Research For Quickly Measuring The Diameter And Roundness Of Solder Balls Based On Machine Vision Technology

IF 2.2 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Packaging Pub Date : 2023-10-30 DOI:10.1115/1.4063918

Tongju Wang, Yahao Liu, Wenqian Zhang, Yongping Lei, Jian Lin, Hanguang Fu, Zipeng Lin

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Abstract

Abstract Solder balls used in electronic packaging should have high dimensional and shape accuracy requirements to ensure the connection quality of solder balls during soldering. However, the existing solder ball detection methods were hard to measure the diameter and roundness in an integrated and fast manner. Therefore, a new method and device for measuring the diameter and roundness of solder balls was proposed based on machine vision technology, including detection device and software design. The experimental device could detect the parameters of at least 40 solder balls at a time. The solder ball image was preprocessed in the software system to improve the quality of the solder ball image, and then the Harris operator successfully detected the concave point on the bonded solder ball image and realized the solder ball separation based on the shortest path matching criterion. Compared with the SEM measurement value, the diameter and roundness of solder balls measured by the detection system were smaller than 3%.

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基于机器视觉技术快速测量焊锡球直径和圆度的研究

摘要电子封装用的焊锡球对尺寸和形状精度要求较高，以保证焊锡球在焊接过程中的连接质量。然而，现有的焊球检测方法难以综合快速地测量焊球的直径和圆度。为此，提出了一种基于机器视觉技术的焊锡球直径和圆度测量的新方法和新装置，包括检测装置和软件设计。该实验装置可同时检测至少40个焊锡球的参数。在软件系统中对焊锡球图像进行预处理，提高焊锡球图像的质量，然后利用Harris算子成功检测出粘结焊锡球图像上的凹点，并基于最短路径匹配准则实现焊锡球分离。与SEM测量值相比，检测系统测得的焊锡球直径和圆度均小于3%。

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来源期刊

Journal of Electronic Packaging 工程技术-工程：电子与电气

CiteScore

4.90

自引率

6.20%

发文量

审稿时长

3 months

期刊介绍： The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.