Investigation of poly (2-methyl imidazole co 1,4-butanediol diglycidyl ether) as a leveler for blind hole copper plating

Advances in Materials Physics and Chemistry Pub Date : 2023-09-09 DOI:10.18282/mpc.v6i1.3354

Xiangjian Zeng, Qiuman Zhou, Zhenjie Yuan, Lixin Huang, Guanghui Hu, Nian He, Qingming Zeng, Zhanchang Pan

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Abstract

The current synthetic leveler agents are complex to operate, troublesome to purify, and low to pore filling rates. Herein, we report a new, simple, green, and inexpensive method for the synthesis of leveler agents and study their properties systematically. In acidic copper sulfate plating solutions, including polyethylene glycol (PEG), sodium 3,3’-dithiodipropane sulfonate (SPS), and chloride ions, the relation between leveler agents (dimethylimidazole and 1,4-butanediol diglycidyl ether) and the filling of blind holes have been investigated. The synthesized leveler agent was structurally characterized by infrared spectroscopy and gel chromatography tests. The plating containing the leveler agent passed plating tests as well as reliability tests and met PCB production requirements. The electrochemical behavior of the leveler agent was investigated using electrochemical tests. The X-ray diffractometer (XRD) was used to observe the differences in crystal orientation on the surface of the plated layers.

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聚(2-甲基咪唑co 1,4-丁二醇二缩水甘油醚)作为盲孔镀铜矫直剂的研究

目前合成的匀平剂操作复杂，提纯困难，孔隙填充率低。本文报道了一种新的、简单的、绿色的、廉价的整平剂合成方法，并对其性能进行了系统的研究。在聚乙二醇(PEG)、3,3′-二硫代二丙烷磺酸钠(SPS)和氯离子组成的酸性硫酸铜电镀溶液中，研究了平准剂(二甲基咪唑和1,4-丁二醇二甘油酯醚)与盲孔填充的关系。通过红外光谱和凝胶色谱对所合成的匀平剂进行了结构表征。含矫直剂的镀层通过电镀试验和可靠性试验，满足PCB生产要求。通过电化学试验研究了该矫直剂的电化学行为。利用x射线衍射仪(XRD)观察了镀层表面晶体取向的差异。

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Advances in Materials Physics and Chemistry

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