{"title":"Reviewer's Recognition","authors":"","doi":"10.1115/1.4056725","DOIUrl":null,"url":null,"abstract":"The Reviewers of the Year Award is given to reviewers who have made an outstanding contribution to the journal in terms of the quantity, quality, and turnaround time of reviews completed during the past 12 months. The prize includes a Wall Plaque, 50 free downloads from the ASME Digital Collection, and a one year free subscription to the journal.T. AnH. BaiM. BudakliF. CheJ. ChenT. ChenH. ChengT. ChiuM. ChowdhuryO. DalvernyB. DogruozC. GanR. GhaffarianD. Gonzalez CuadradoC. GreenP. GromalaM. GuptaY. HuangD. HuitinkT. IkedaC. KapustaB. KellyC. KhorH. LeeD. LiuA. MianK. MysoreD. NarasimhanJ. NiG. OnushkinD. PahinkarD. PantusoS. ParupalliG. PavlidisD. Ramos AlvaradoD. RaoM. ShihA. SinghJ. TsaiA. UdupaA. UsmanM. Van DijkW. Van DrielM. Van SoestbergenG. WangR. WarzohaJ. XuJ. YangM. Yazdan MehrA. YeoD. YuC. YuanZ. ZhangS. ZhaoQ. Zheng","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":null,"pages":null},"PeriodicalIF":2.2000,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/1.4056725","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The Reviewers of the Year Award is given to reviewers who have made an outstanding contribution to the journal in terms of the quantity, quality, and turnaround time of reviews completed during the past 12 months. The prize includes a Wall Plaque, 50 free downloads from the ASME Digital Collection, and a one year free subscription to the journal.T. AnH. BaiM. BudakliF. CheJ. ChenT. ChenH. ChengT. ChiuM. ChowdhuryO. DalvernyB. DogruozC. GanR. GhaffarianD. Gonzalez CuadradoC. GreenP. GromalaM. GuptaY. HuangD. HuitinkT. IkedaC. KapustaB. KellyC. KhorH. LeeD. LiuA. MianK. MysoreD. NarasimhanJ. NiG. OnushkinD. PahinkarD. PantusoS. ParupalliG. PavlidisD. Ramos AlvaradoD. RaoM. ShihA. SinghJ. TsaiA. UdupaA. UsmanM. Van DijkW. Van DrielM. Van SoestbergenG. WangR. WarzohaJ. XuJ. YangM. Yazdan MehrA. YeoD. YuC. YuanZ. ZhangS. ZhaoQ. Zheng
期刊介绍：
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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