A compact high gain wideband millimeter wave 1 × 2 array antenna for 26/28 GHz 5G applications

IF 0.8 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Circuit World Pub Date : 2021-12-21 DOI:10.1108/cw-10-2021-0255
Yousra Ghazaoui, Mohammed EL Ghzaoui, Sudipta Das, BTP Madhav, Ali el Alami
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Abstract

Purpose

This paper aims to present the design, fabrication and analysis of a wideband, enhanced gain 1 × 2 patch antenna array with a simple profile structure to meet the desired antenna traits, such as wide bandwidth, high gain and directional patterns expected for the upcoming fifth-generation (5G) wireless applications in the millimeter wave band. To enhance these parameters (bandwidth and gain), a new antenna geometry by using a T-junction power divider is presented.

Design/methodology/approach

The theory behind this paper is connected with advancements in the 5G communications related to antennas. The methodology used in this work is to design a high gain array antenna and to identify the best possible power divider to deliver the power in an optimized way. The design methodology adopts several steps like the selection of proper substrate material as per the design specification, size of the antenna as per the frequency of operation and application-specific environment condition. The simulation has been performed on the designed antenna in the electromagnetic simulation tool (high-frequency structure simulator [HFSS]), and optimization has been done with parametric analysis, and then the final array antenna model is proposed. The proposed array contains 2-patch elements excited by one port adapted to 50 Ω through a T-junction power divider. The 1 × 2 array configuration with the suggested geometry helps to improve the overall gain of the antenna, and the implementation of the T-junction power divider provides enhanced bandwidth. The proposed array designed using a 1.6 mm thick flame retardant substrate occupies a compact area of 14 × 12.14 mm2.

Findings

The prototype of the array antenna is fabricated and measured to validate the design concept. A good agreement has been reached between the measured and simulated antenna parameters. The measured results confirm its wideband and high gain characteristics, covering 24.77–28.80 GHz for S11= –10 dB with a peak gain of about 15.16 dB at 27.65 GHz.

Originality/value

The proposed antenna covers the bandwidth requirements of the 26 GHz n258 band (24.25–27.50 GHz) to be deployed in the UK and Europe. The suggested antenna structure also covers the federal communications commission (FCC)-regulated 28 GHz n261 band (27.5–28.35 GHz) to be deployed in America and Canada. The low profile, compact size, simple structure, wide bandwidth, high gain and desired directional radiation patterns confirm the applicability of the suggested array antenna for the upcoming 5 G wireless systems.

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一种紧凑型高增益宽带毫米波1 × 2阵列天线,适用于26/28 GHz 5G应用
为了满足即将到来的第五代(5G)无线应用在毫米波频段的宽带、高增益和方向图等天线特性,设计、制造和分析了一种具有简单轮廓结构的宽带、增强增益1 × 2贴片天线阵列。为了提高这些参数(带宽和增益),提出了一种使用t结功率分配器的新天线几何形状。设计/方法/方法本文背后的理论与天线相关的5G通信的进步有关。在这项工作中使用的方法是设计一个高增益阵列天线,并确定最佳的功率分配器,以优化的方式提供功率。设计方法采用几个步骤,如根据设计规范选择合适的衬底材料,根据工作频率和特定应用环境条件选择天线尺寸。在电磁仿真工具(高频结构模拟器[HFSS])中对所设计的天线进行仿真,并通过参数化分析进行优化,最后提出最终的阵列天线模型。所提出的阵列包含2个贴片元件,通过一个t结功率分压器通过一个适应50 Ω的端口激发。采用建议几何形状的1 × 2阵列配置有助于提高天线的整体增益,t结功率分配器的实现提供了增强的带宽。采用1.6 mm厚的阻燃衬底设计的阵列占地面积为14 × 12.14 mm2。制作了阵列天线的原型并进行了测量以验证设计概念。实测天线参数与仿真天线参数吻合较好。实测结果证实了其宽带高增益特性,在S11= -10 dB时覆盖24.77 ~ 28.80 GHz,在27.65 GHz时峰值增益约为15.16 dB。提议的天线涵盖了将在英国和欧洲部署的26 GHz n258频段(24.25-27.50 GHz)的带宽要求。拟议的天线结构还包括联邦通信委员会(FCC)规定的28ghz n261频段(27.5-28.35 GHz),将部署在美国和加拿大。低姿态、紧凑的尺寸、简单的结构、宽带宽、高增益和理想的定向辐射模式证实了所建议的阵列天线在即将到来的5g无线系统中的适用性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Circuit World
Circuit World 工程技术-材料科学:综合
CiteScore
2.60
自引率
0.00%
发文量
33
审稿时长
>12 weeks
期刊介绍: Circuit World is a platform for state of the art, technical papers and editorials in the areas of electronics circuit, component, assembly, and product design, manufacture, test, and use, including quality, reliability and safety. The journal comprises the multidisciplinary study of the various theories, methodologies, technologies, processes and applications relating to todays and future electronics. Circuit World provides a comprehensive and authoritative information source for research, application and current awareness purposes. Circuit World covers a broad range of topics, including: • Circuit theory, design methodology, analysis and simulation • Digital, analog, microwave and optoelectronic integrated circuits • Semiconductors, passives, connectors and sensors • Electronic packaging of components, assemblies and products • PCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes) • Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal) • Internet of Things (IoT).
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