Indira Damarla, Venmathi M., Krishnakumar V., Anbarasan P.
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引用次数: 0
Abstract
Purpose
In this paper, a new front end converter (FEC) topology has been proposed for the switched reluctance (SR) motor drive. This study aims to present the performance analysis of FEC-based SR motor drive using various types of control schemes like conventional proportional integral (PI) controller, fuzzy logic controller (FLC) and fuzzy-tuned proportional integral controller (Fuzzy-PI).
Design/methodology/approach
The proposed FEC-based SR motor drive with various control strategies is derived for the torque ripple minimization and speed control.
Findings
The steady state and the dynamic response of the FEC-based SR motor drive are analyzed using three different controllers under change in speed and loading conditions. The Fuzzy-PI-based control scheme improves the dynamic response of the system when compared with the FLC and the conventional PI controller.
Originality/value
The hardware prototype has been implemented for the FEC-based SR motor drive by using the Xilinx SPARTAN 6 FPGA processor. The experimental verification has been conducted and the results have been measured under steady state and dynamic conditions.
目的 本文针对开关磁阻(SR)电机驱动提出了一种新的前端转换器(FEC)拓扑结构。本研究旨在介绍基于 FEC 的 SR 电机驱动器的性能分析,该驱动器采用了各种类型的控制方案,如传统比例积分控制器 (PI)、模糊逻辑控制器 (FLC) 和模糊调整比例积分控制器 (Fuzzy-PI)。研究结果使用三种不同的控制器分析了基于 FEC 的 SR 电机驱动器在速度和负载变化条件下的稳态和动态响应。与 FLC 和传统 PI 控制器相比,基于模糊 PI 的控制方案改善了系统的动态响应。进行了实验验证,并在稳态和动态条件下测量了结果。
期刊介绍:
Circuit World is a platform for state of the art, technical papers and editorials in the areas of electronics circuit, component, assembly, and product design, manufacture, test, and use, including quality, reliability and safety. The journal comprises the multidisciplinary study of the various theories, methodologies, technologies, processes and applications relating to todays and future electronics. Circuit World provides a comprehensive and authoritative information source for research, application and current awareness purposes.
Circuit World covers a broad range of topics, including:
• Circuit theory, design methodology, analysis and simulation
• Digital, analog, microwave and optoelectronic integrated circuits
• Semiconductors, passives, connectors and sensors
• Electronic packaging of components, assemblies and products
• PCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes)
• Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal)
• Internet of Things (IoT).