{"title":"Effect of basal plane dislocation structures on single Shockley-type stacking fault expansion rate in 4H-SiC","authors":"Johji Nishio, Chiharu Ota, Ryosuke Iijima","doi":"10.35848/1347-4065/ad0e27","DOIUrl":null,"url":null,"abstract":"The expansion rate of single Shockley-type stacking faults (1SSFs) was examined in 4H-SiC under UV illumination in various basal plane dislocation (BPD) structures with 90° or 30° Si-core partial dislocations (PDs) at the expansion front. In the case of 30° Si-core PDs at the front, we found some BPDs with extremely slow expansion rates. Photoluminescence imaging revealed that the BPDs were accompanied by characteristic dim lines in the shallower parts of the epitaxial layers. We confirmed that the lines were threading edge dislocations by transmission electron microscopy. Additional high-resolution scanning transmission electron microscope analysis revealed that the leading partial was a 30° C-core instead of a 30° Si-core. This implies the large amount of C-core segments on the expanding PD might be the reason for the 1SSFs having very slow expansion rates. Moreover, the expansion rate of 90° Si-core PDs was obtained experimentally and compared with that of 30° PDs.","PeriodicalId":14741,"journal":{"name":"Japanese Journal of Applied Physics","volume":"94 1","pages":""},"PeriodicalIF":1.5000,"publicationDate":"2024-01-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Japanese Journal of Applied Physics","FirstCategoryId":"101","ListUrlMain":"https://doi.org/10.35848/1347-4065/ad0e27","RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"PHYSICS, APPLIED","Score":null,"Total":0}
引用次数: 0
Abstract
The expansion rate of single Shockley-type stacking faults (1SSFs) was examined in 4H-SiC under UV illumination in various basal plane dislocation (BPD) structures with 90° or 30° Si-core partial dislocations (PDs) at the expansion front. In the case of 30° Si-core PDs at the front, we found some BPDs with extremely slow expansion rates. Photoluminescence imaging revealed that the BPDs were accompanied by characteristic dim lines in the shallower parts of the epitaxial layers. We confirmed that the lines were threading edge dislocations by transmission electron microscopy. Additional high-resolution scanning transmission electron microscope analysis revealed that the leading partial was a 30° C-core instead of a 30° Si-core. This implies the large amount of C-core segments on the expanding PD might be the reason for the 1SSFs having very slow expansion rates. Moreover, the expansion rate of 90° Si-core PDs was obtained experimentally and compared with that of 30° PDs.
期刊介绍:
The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP).
JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields:
• Semiconductors, dielectrics, and organic materials
• Photonics, quantum electronics, optics, and spectroscopy
• Spintronics, superconductivity, and strongly correlated materials
• Device physics including quantum information processing
• Physics-based circuits and systems
• Nanoscale science and technology
• Crystal growth, surfaces, interfaces, thin films, and bulk materials
• Plasmas, applied atomic and molecular physics, and applied nuclear physics
• Device processing, fabrication and measurement technologies, and instrumentation
• Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS