{"title":"First-principles study for orientation dependence of band alignments at 4H-SiC/SiO2 interface","authors":"Shun Matsuda, Toru Akiyama, Tetsuo Hatakeyama, Kenji Shiraishi, Takashi Nakayama","doi":"10.35848/1347-4065/ad1897","DOIUrl":null,"url":null,"abstract":"The orientation dependence of band alignments and the formation of dipoles at 4H-SiC/SiO2 interface are theoretically investigated on the basis of first-principles calculations. The calculations demonstrate that the offsets of valence and conduction bands depend on the surface orientation and chemical bonds at 4H-SiC/SiO2 interface. The conduction band offset on the Si-face is larger than those on the C-face and m-face. Furthermore, it is found the atomic configurations at 4H-SiC/SiO2 interface results in the formation of dipoles, whose magnitude is large for Si-O and C-O bonds. The formation of large dipoles significantly changes the band structure of 4H-SiC, resulting in large conduction bands offset. Therefore, the formation of Si-O bond with large dipoles at the interface is of importance in order to obtain large conduction band offset. The calculated results give insights to improve the reliability in SiC metal-oxide-semiconductor field-effect transistors.","PeriodicalId":14741,"journal":{"name":"Japanese Journal of Applied Physics","volume":"36 1","pages":""},"PeriodicalIF":1.5000,"publicationDate":"2023-12-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Japanese Journal of Applied Physics","FirstCategoryId":"101","ListUrlMain":"https://doi.org/10.35848/1347-4065/ad1897","RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"PHYSICS, APPLIED","Score":null,"Total":0}
引用次数: 0
Abstract
The orientation dependence of band alignments and the formation of dipoles at 4H-SiC/SiO2 interface are theoretically investigated on the basis of first-principles calculations. The calculations demonstrate that the offsets of valence and conduction bands depend on the surface orientation and chemical bonds at 4H-SiC/SiO2 interface. The conduction band offset on the Si-face is larger than those on the C-face and m-face. Furthermore, it is found the atomic configurations at 4H-SiC/SiO2 interface results in the formation of dipoles, whose magnitude is large for Si-O and C-O bonds. The formation of large dipoles significantly changes the band structure of 4H-SiC, resulting in large conduction bands offset. Therefore, the formation of Si-O bond with large dipoles at the interface is of importance in order to obtain large conduction band offset. The calculated results give insights to improve the reliability in SiC metal-oxide-semiconductor field-effect transistors.
期刊介绍:
The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP).
JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields:
• Semiconductors, dielectrics, and organic materials
• Photonics, quantum electronics, optics, and spectroscopy
• Spintronics, superconductivity, and strongly correlated materials
• Device physics including quantum information processing
• Physics-based circuits and systems
• Nanoscale science and technology
• Crystal growth, surfaces, interfaces, thin films, and bulk materials
• Plasmas, applied atomic and molecular physics, and applied nuclear physics
• Device processing, fabrication and measurement technologies, and instrumentation
• Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS