M. Kardan, N. Levichev, Sylvie Castagne, Joost R. Duflou
{"title":"Cutting thick aluminum plates using laser fusion cutting enhanced by dynamic beam shaping","authors":"M. Kardan, N. Levichev, Sylvie Castagne, Joost R. Duflou","doi":"10.2351/7.0001095","DOIUrl":null,"url":null,"abstract":"Cutting thick plates is affected not only by the laser power but also by the cut kerf width and the melt flow dynamics that determine the ejection of the molten material. Employing the same laser beam intensity distribution for various thicknesses is the limiting factor when cutting thicker plates. This paper investigates fiber laser fusion cutting of 25 mm thick aluminum with dynamic beam shaping (DBS). While both static and longitudinal dynamic intensity distributions fail to cut this thickness with a 4 kW laser power, a cut through is achieved using annular and elliptical intensity distributions. However, an improvement of 45% in cutting speed can be achieved using an elliptical intensity distribution compared to an annular one. In order to understand the effect of the beam shape, an infrared thermal camera is used to study lateral heat propagation when using different process parameters. Moreover, to analyze the melt flow when changing the DBS frequency, high-speed imaging is utilized to observe the molten material inside the cut kerf. Finally, the cut edge quality is investigated for different cutting conditions.","PeriodicalId":50168,"journal":{"name":"Journal of Laser Applications","volume":"64 1","pages":""},"PeriodicalIF":1.7000,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Laser Applications","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.2351/7.0001095","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Cutting thick plates is affected not only by the laser power but also by the cut kerf width and the melt flow dynamics that determine the ejection of the molten material. Employing the same laser beam intensity distribution for various thicknesses is the limiting factor when cutting thicker plates. This paper investigates fiber laser fusion cutting of 25 mm thick aluminum with dynamic beam shaping (DBS). While both static and longitudinal dynamic intensity distributions fail to cut this thickness with a 4 kW laser power, a cut through is achieved using annular and elliptical intensity distributions. However, an improvement of 45% in cutting speed can be achieved using an elliptical intensity distribution compared to an annular one. In order to understand the effect of the beam shape, an infrared thermal camera is used to study lateral heat propagation when using different process parameters. Moreover, to analyze the melt flow when changing the DBS frequency, high-speed imaging is utilized to observe the molten material inside the cut kerf. Finally, the cut edge quality is investigated for different cutting conditions.
期刊介绍:
The Journal of Laser Applications (JLA) is the scientific platform of the Laser Institute of America (LIA) and is published in cooperation with AIP Publishing. The high-quality articles cover a broad range from fundamental and applied research and development to industrial applications. Therefore, JLA is a reflection of the state-of-R&D in photonic production, sensing and measurement as well as Laser safety.
The following international and well known first-class scientists serve as allocated Editors in 9 new categories:
High Precision Materials Processing with Ultrafast Lasers
Laser Additive Manufacturing
High Power Materials Processing with High Brightness Lasers
Emerging Applications of Laser Technologies in High-performance/Multi-function Materials and Structures
Surface Modification
Lasers in Nanomanufacturing / Nanophotonics & Thin Film Technology
Spectroscopy / Imaging / Diagnostics / Measurements
Laser Systems and Markets
Medical Applications & Safety
Thermal Transportation
Nanomaterials and Nanoprocessing
Laser applications in Microelectronics.