Dual-Band Dual-Polarized Antennas for 5G mmWave Base Stations

T. H. Le, Ivan Ndip, Martin Schneider-Ramelow
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Abstract

In this paper, we present a systematic approach for the development of application-specific antennas for 5G millimeter-wave (mmWave) base stations. First, an in-depth analysis of 5G mmWave base stations considering the required antenna gain and antenna elements to address different equivalent isotropic radiated power requirements is presented. This is followed by an evaluation of the realistic impact of different factors, which affect mmWave communication, namely output power of power amplifiers, antenna gain, losses and weather condition (rain), on transmission ranges between base station and terminals, considering the link budget analysis for an Urban Macro cell with the Non-Line-of-Sight transmission, as an example. Finally, based on a comparative analysis of published dual-band dual-polarized 5G mmWave antennas, we propose a novel configuration of a dual-band dual-polarized antenna for 5G mmWave base station applications, which overcomes the limitations of conventional antennas in published literature. Our proposed antenna covers the specified 3GHz bandwidths in the 5G mmWave n257 and n260 bands and reaches approximately 6 and 6.7 dBi, respectively in these bands. Furthermore, it exhibits at least 20 dB isolation between the polarizations and has dimensions of 1.831.83 1.2 mm. We modeled, simulated, fabricated, measured and analyzed this new antenna configuration. Excellent correlation is obtained between measurement and simulation results.
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用于 5G 毫米波基站的双频双极化天线
在本文中,我们介绍了一种为 5G 毫米波(mmWave)基站开发特定应用天线的系统方法。首先,本文对 5G 毫米波基站进行了深入分析,考虑了所需的天线增益和天线元件,以满足不同的等效各向同性辐射功率要求。随后,以非线性传输的城市宏蜂窝的链路预算分析为例,评估了影响毫米波通信的不同因素(即功率放大器的输出功率、天线增益、损耗和天气条件(雨))对基站和终端之间传输距离的实际影响。最后,在对已发表的双频双极化 5G 毫米波天线进行比较分析的基础上,我们为 5G 毫米波基站应用提出了一种新颖的双频双极化天线配置,克服了已发表文献中传统天线的局限性。我们提出的天线覆盖了 5G 毫米波 n257 和 n260 波段中指定的 3GHz 带宽,在这些波段中分别达到约 6 和 6.7 dBi。此外,它的极化间隔离度至少为 20 dB,尺寸为 1.831.83 1.2 mm。我们对这种新型天线配置进行了建模、模拟、制造、测量和分析。测量结果与模拟结果之间具有极好的相关性。
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来源期刊
Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering
CiteScore
1.30
自引率
0.00%
发文量
5
期刊介绍: The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.
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