Difference in the structure and morphology of CVD diamond films grown on negatively charged and grounded substrate holders: Optical study

Iu.M. Nasieka, V.E. Strelnitski, O.A. Opalev, V.I. Gritsina, K.I. Koshevyi, O.Ya. Horobei, V.V. Lementaryov, V.I. Trokhaniak, M.I. Boyko
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Abstract

Microcrystalline diamond films were grown by plasma-enhanced chemical vapor deposition from a CH4/H2 gas mixture on Si single-crystalline substrates placed on negatively charged and grounded substrate holders. The obtained diamond films had the (100) predominant faceting of microcrystals. The film structure and morphology were analyzed by scanning electron microscopy, photoluminescence, Raman and FTIR spectroscopies. The main physical factor causing the difference in the structure of the diamond films grown on the grounded and charged substrate holders was found to be the flow of low-energy (up to 200 eV) Si+, N2+, H, O ions in the latter holder. These ions predominantly embedded into the structure of the diamond films grown on the charged substrate holder leading to appearance of residual mechanical stress up to 2 GPa. Ion bombardment led to increase in the volume fraction of non-diamond carbon component in the film grain boundaries, decrease in sp3-bonded carbon fraction and reduction of the diamond microcrystals lateral size. Larger amount of grain boundaries in the diamond films grown on the charged substrate holder promoted diffusion of Si atoms from the substrate to the plasma and growing film surface, inducing formation of SiV centers in the diamond microcrystals even in the 150…200 μm thick films. The concentration of Si-related defects was much smaller in the films grown using the grounded substrate holder. These films had substantially smaller volume fraction of graphite-like carbon in the grain boundaries and were more homogeneous.
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在带负电和接地基底支架上生长的 CVD 金刚石薄膜的结构和形态差异:光学研究
微晶金刚石薄膜是通过等离子体增强化学气相沉积法在硅单晶衬底上从 CH4/H2 混合气体中生长出来的,衬底放置在带负电和接地的衬底支架上。获得的金刚石薄膜具有 (100) 优势微晶面。通过扫描电子显微镜、光致发光、拉曼和傅立叶变换红外光谱分析了薄膜的结构和形态。研究发现,导致在接地基底和带电基底支架上生长的金刚石薄膜结构不同的主要物理因素是低能(高达 200 eV)Si+、N2+、H、O 离子在带电基底支架上的流动。这些离子主要嵌入带电基底支架上生长的金刚石薄膜的结构中,导致出现高达 2 GPa 的残余机械应力。离子轰击导致薄膜晶界中非金刚石碳成分的体积分数增加,sp3 键碳分数减少,金刚石微晶的横向尺寸减小。在带电基底支架上生长的金刚石薄膜晶界较多,促进了硅原子从基底向等离子体和生长薄膜表面的扩散,即使在 150...200 μm 厚的薄膜中也会在金刚石微晶中形成 SiV 中心。在使用接地基底支架生长的薄膜中,Si 相关缺陷的浓度要小得多。这些薄膜晶界中石墨状碳的体积分数要小得多,而且更加均匀。
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