Performance improvement of multilayered ZnO/SnO2 thin-film transistors by varying supercycles and growth temperatures

IF 1.4 4区 物理与天体物理 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Solid-state Electronics Pub Date : 2024-03-30 DOI:10.1016/j.sse.2024.108920
Chan-Yeong Park, Se-Hyeong Lee, So-Young Bak, Dongki Baek, Hyeongrok Jang, Jinwoo Lee, Moonsuk Yi
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Abstract

The performance of conventional ZnSnO (ZTO) amorphous oxide semiconductor thin-film transistors deposited by atomic layer deposition was optimized at annealing temperatures greater than 500 °C, which is higher than the application temperature of flexible substrates (400 °C). Therefore, we deposited a ZTO thin film as a multilayered ZnO/SnO2 structure to lower the process temperature to below 400 °C. To optimize the performance of the device with a multilayered structure, we examined the effects of cycles and growth temperatures. Finally, after performing 6 supercycles with 10 cycles of ZnO and 20 cycles of SnO2, at a growth temperature of 180 °C and annealing at 350 °C for 1 h, the device achieved a saturation carrier mobility of 8.09 cm2/V·s, threshold voltage of 1.6 V, subthreshold swing of 0.58 V/dec, and on–off current ratio of 2.63 × 107. The optimized multilayer-structured device performed better than the ZTO device annealed at 350 °C for 1 h, and even outperformed the device annealed at 500 °C for 1 h. X-ray photoelectron spectroscopy analysis was also conducted to analyze the properties of conventional ZTO and multilayered ZnO/SnO2 thin films.

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通过改变超循环和生长温度提高多层 ZnO/SnO2 薄膜晶体管的性能
通过原子层沉积法沉积的传统 ZnSnO(ZTO)非晶氧化物半导体薄膜晶体管在退火温度超过 500 ℃ 时性能达到最佳,而这一温度高于柔性衬底的应用温度(400 ℃)。因此,我们将 ZTO 薄膜沉积为多层 ZnO/SnO2 结构,将工艺温度降至 400 °C 以下。为了优化多层结构器件的性能,我们研究了循环和生长温度的影响。最后,在生长温度为 180 ℃、退火温度为 350 ℃ 1 小时的条件下,ZnO 和 SnO2 分别进行了 10 次和 20 次的 6 次超级循环,器件的饱和载流子迁移率达到了 8.09 cm2/V-s,阈值电压为 1.6 V,阈下摆幅为 0.58 V/dec,导通-关断电流比为 2.63 × 107。优化的多层结构器件的性能优于在 350 °C 下退火 1 小时的 ZTO 器件,甚至超过了在 500 °C 下退火 1 小时的器件。
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来源期刊
Solid-state Electronics
Solid-state Electronics 物理-工程:电子与电气
CiteScore
3.00
自引率
5.90%
发文量
212
审稿时长
3 months
期刊介绍: It is the aim of this journal to bring together in one publication outstanding papers reporting new and original work in the following areas: (1) applications of solid-state physics and technology to electronics and optoelectronics, including theory and device design; (2) optical, electrical, morphological characterization techniques and parameter extraction of devices; (3) fabrication of semiconductor devices, and also device-related materials growth, measurement and evaluation; (4) the physics and modeling of submicron and nanoscale microelectronic and optoelectronic devices, including processing, measurement, and performance evaluation; (5) applications of numerical methods to the modeling and simulation of solid-state devices and processes; and (6) nanoscale electronic and optoelectronic devices, photovoltaics, sensors, and MEMS based on semiconductor and alternative electronic materials; (7) synthesis and electrooptical properties of materials for novel devices.
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