{"title":"Theoretical study of extreme ultraviolet pellicles with nanometer thicknesses","authors":"Sang-Kon Kim","doi":"10.1016/j.sse.2024.108924","DOIUrl":null,"url":null,"abstract":"<div><p>Extreme ultraviolet (EUV) pellicles are required for EUV defectivity management in high volume manufacturing (HVM). Theoretical analysis of EUV pellicles of nanometer thickness is helpful for these fabrications. In this paper, for maximum transverse deflection, an analytical–numerical method is contrasted against the finite element method (FEM) due to the ratio of thickness and width length of EUV pellicles. The difference was increased at a thickness of micron unit. Single- and multiple-variable methods of linear regression in deep learning were used to overcome the ANSYS limitation based on FEM, such as the meshing of more than 10 <span><math><mrow><mi>μ</mi><mi>m</mi></mrow></math></span> thickness, and shear loading, an error in FEM resulting from the impact on the stiffness matrix caused by variations in the length-to-thickness ratio increases in the beam element, respectively.</p></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"216 ","pages":"Article 108924"},"PeriodicalIF":1.4000,"publicationDate":"2024-03-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Solid-state Electronics","FirstCategoryId":"101","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S003811012400073X","RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Extreme ultraviolet (EUV) pellicles are required for EUV defectivity management in high volume manufacturing (HVM). Theoretical analysis of EUV pellicles of nanometer thickness is helpful for these fabrications. In this paper, for maximum transverse deflection, an analytical–numerical method is contrasted against the finite element method (FEM) due to the ratio of thickness and width length of EUV pellicles. The difference was increased at a thickness of micron unit. Single- and multiple-variable methods of linear regression in deep learning were used to overcome the ANSYS limitation based on FEM, such as the meshing of more than 10 thickness, and shear loading, an error in FEM resulting from the impact on the stiffness matrix caused by variations in the length-to-thickness ratio increases in the beam element, respectively.
期刊介绍：
It is the aim of this journal to bring together in one publication outstanding papers reporting new and original work in the following areas: (1) applications of solid-state physics and technology to electronics and optoelectronics, including theory and device design; (2) optical, electrical, morphological characterization techniques and parameter extraction of devices; (3) fabrication of semiconductor devices, and also device-related materials growth, measurement and evaluation; (4) the physics and modeling of submicron and nanoscale microelectronic and optoelectronic devices, including processing, measurement, and performance evaluation; (5) applications of numerical methods to the modeling and simulation of solid-state devices and processes; and (6) nanoscale electronic and optoelectronic devices, photovoltaics, sensors, and MEMS based on semiconductor and alternative electronic materials; (7) synthesis and electrooptical properties of materials for novel devices.
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