On-Site Application of End-Grain Bonded Timber Under Low Curing Temperatures

Abstract

The end-grain bonding of timber components using the Timber Structures 3.0 technology (TS3) is an advancing construction method in timber engineering. This technology allows the realisation of any plate size by bonding plates on-site where low temperatures influence the performance. Therefore, investigations are underway to evaluate the influence of the low temperatures on the curing process. Additionally, research is in progress to discover techniques to reduce any adverse effects of low curing temperatures on the mechanical properties of the bond. The implementation of particular measures, such as the inclusion of milled heating wires into the joint and the pre-heating of the joint with a hot air blower, has been identified as advancing the potential for grouting even in the face of low external temperatures, as recent research has indicated.