Vinzenz Ginster, Maximilian Klaus Heym, Christoph Jürgen Anton Beier, Maike Epperlein, Alexander Schiebahn, Uwe Reisgen
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引用次数: 0
Abstract
Metal foils are being widely used, from the chemical or electronics sector to household appliances. The joining of these foils by adhesive bonding is often the preferred method due to discolouring and warping under the thermal stresses of other joining methods, such as welding. However, long curing times are a disadvantage of adhesive bonding compared to welding. The use of electromagnetic induction is a promising solution for accelerated curing. This work investigates induction heating for accelerated curing of 1-C epoxy adhesives for bonding of thin nickel foils. Process parameters for rapid curing of the adhesives were determined based on reaction kinetics using differential scanning calorimetry measurements. According to those results peel test specimens were fabricated, and the peel resistance was evaluated using a 90° peel load.
期刊介绍：
The Journal of Materials: Design and Applications covers the usage and design of materials for application in an engineering context. The materials covered include metals, ceramics, and composites, as well as engineering polymers.
"The Journal of Materials Design and Applications is dedicated to publishing papers of the highest quality, in a timely fashion, covering a variety of important areas in materials technology. The Journal''s publishers have a wealth of publishing expertise and ensure that authors are given exemplary service. Every attention is given to publishing the papers as quickly as possible. The Journal has an excellent international reputation, with a corresponding international Editorial Board from a large number of different materials areas and disciplines advising the Editor." Professor Bill Banks - University of Strathclyde, UK
This journal is a member of the Committee on Publication Ethics (COPE).
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