Triple-metal gate work function engineering to improve the performance of junctionless cylindrical gate-all-around Si nanowire MOSFETs for the upcoming sub-3-nm technology node

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Computational Electronics Pub Date : 2024-04-15 DOI:10.1007/s10825-024-02148-7
Sanjay, Vibhor Kumar, Anil Vohra
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Abstract

Moore’s law, along with the International Roadmap for Devices and Systems, continues to guide the scaling of devices below 10 nm. The challenges posed by such small-dimensioned devices form the basis of the present work. A junctionless MOSFET with a triple-metal gate structure is proposed as an alternative to conventional single-gate bulk MOSFETs for future CMOS technology. The present work investigated the direct current and analog/radio frequency characteristics including the drain current \(({I}_{{\text{D}}}\)), transconductance \({(g}_{m})\), transconductance generation factor (TGF), cut-off frequency \({(f}_{T})\), frequency–transconductance product (FTP), transit time \((\tau ),\) and the total resistance of the source region, drain region, and channel \({(R}_{{\text{SD}}+{\text{CH}}})\) for triple-metal (TM) inversion-mode (IM) and junctionless (JL) cylindrical gate-all-around (CGAA) silicon nanowire (SiNW) MOSFETs with 3-nm gate length using the Silvaco ATLAS 3D TCAD tool. The non-equilibrium Green’s function and the self-consistent solution of the Schrödinger and Poisson equations were considered. The channel was taken to be lightly doped in the case of the IM TM CGAA SiNW device. The effect of the TM gate work function engineering for a SiNW channel with a diameter of 3 nm and gate oxide \(({{{\text{Al}}}_{2}{\text{O}}}_{3})\) thickness of 0.8 nm was investigated with respect to \({I}_{D}\),\({ g}_{m}\), TGF, \({f}_{T}\), \(\tau\), FTP, and \({R}_{{\text{SD}}+{\text{CH}}}\), and a comparative study between the IM TM and JL TM CGAA SiNW devices was carried out with respect to these parameters. For the JL device, optimization of the doping concentration was performed to obtain the same (i) ION current and (ii) threshold voltage (VTH) as the IM device. An 8.61- and 5.72-fold reduction in IOFF was seen for the same ION and VTH for the JL versus the IM device. It was found that the TM gate variation led to a reduction in drain-induced barrier lowering (DIBL) in the IM and JL devices. The JL SiNW showed much lower DIBL of ~39.49 mV/V, a near-ideal subthreshold slope (SS) of ~60 mV/dec, and higher \({{\text{I}}}_{{\text{ON}}}/{{\text{I}}}_{{\text{OFF}}}\) current ratio of ~2.98 × 1012. which is much better than the values reported in the literature for CGAA devices. Also, the JL SiNW device was found to perform better than the IM SiNW device in terms of SS, DIBL, \({{\text{I}}}_{{\text{ON}}}/{{\text{I}}}_{{\text{OFF}}}\), \({g}_{m},\) TGF, fT, \(\tau\), FTP, and \({R}_{{\text{SD}}+{\text{CH}}}\).

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通过三金属栅极工作函数工程提高无结圆柱栅极全环绕硅纳米线 MOSFET 的性能,以适应即将到来的 3 纳米以下技术节点的要求
摩尔定律以及 "国际器件与系统路线图 "继续指导着 10 纳米以下器件的扩展。这种小尺寸器件所带来的挑战是本研究工作的基础。我们提出了一种具有三重金属栅结构的无结 MOSFET,作为传统单栅体 MOSFET 的替代品,用于未来的 CMOS 技术。本研究调查了直流和模拟/无线电频率特性,包括漏极电流(({I}_{text{D}})、跨导(({(g}_{m})})、跨导生成因子(TGF)、截止频率(({(f}_{T})})、频率-跨导乘积(FTP)、传输时间((\tau )、\)以及源极区、漏极区和沟道的总电阻({(R}_{text{SD}}+{text{CH}}}),这些数据是使用 Silvaco ATLAS 3D TCAD 工具计算的,适用于 3nm 栅极长度的三金属(TM)反转模式(IM)和无结(JL)圆柱栅全绕(CGAA)硅纳米线(SiNW)MOSFET。考虑了非平衡格林函数以及薛定谔方程和泊松方程的自洽解。在 IM TM CGAA SiNW 器件中,沟道被视为轻掺杂。对于直径为 3 nm、栅极氧化物(({{text{Al}}_{2}{text{O}}}_{3})厚度为 0.8 nm)、TGF、({f}_{T}\)、\(\tau\)、FTP 和\({R}_{text{SD}}+{text{CH}}\)进行了研究,并就这些参数对 IM TM 和 JL TM CGAA SiNW 器件进行了比较研究。对于 JL 器件,对掺杂浓度进行了优化,以获得与 IM 器件相同的 (i) 离子电流和 (ii) 阈值电压 (VTH)。与 IM 器件相比,在相同离子电流和 VTH 条件下,JL 器件的 IOFF 分别降低了 8.61 倍和 5.72 倍。研究发现,TM 栅极变化导致 IM 和 JL 器件的漏极诱导势垒降低 (DIBL) 减少。JL SiNW 的 DIBL 更低,约为 39.49 mV/V,阈下斜率 (SS) 接近理想值,约为 60 mV/dec,电流比更高,约为 2.98 × 1012。此外,在SS、DIBL方面,JL SiNW器件的性能也优于IM SiNW器件、\({{text{I}}}_{text{ON}}}/{{\text{I}}}_{{text{OFF}}})、\({g}_{m},\) TGF、fT、\(\tau\)、FTP和\({R}_{\text{SD}}+{\text{CH}}})。
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来源期刊
Journal of Computational Electronics
Journal of Computational Electronics ENGINEERING, ELECTRICAL & ELECTRONIC-PHYSICS, APPLIED
CiteScore
4.50
自引率
4.80%
发文量
142
审稿时长
>12 weeks
期刊介绍: he Journal of Computational Electronics brings together research on all aspects of modeling and simulation of modern electronics. This includes optical, electronic, mechanical, and quantum mechanical aspects, as well as research on the underlying mathematical algorithms and computational details. The related areas of energy conversion/storage and of molecular and biological systems, in which the thrust is on the charge transport, electronic, mechanical, and optical properties, are also covered. In particular, we encourage manuscripts dealing with device simulation; with optical and optoelectronic systems and photonics; with energy storage (e.g. batteries, fuel cells) and harvesting (e.g. photovoltaic), with simulation of circuits, VLSI layout, logic and architecture (based on, for example, CMOS devices, quantum-cellular automata, QBITs, or single-electron transistors); with electromagnetic simulations (such as microwave electronics and components); or with molecular and biological systems. However, in all these cases, the submitted manuscripts should explicitly address the electronic properties of the relevant systems, materials, or devices and/or present novel contributions to the physical models, computational strategies, or numerical algorithms.
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