An analysis of the impact of nanofluids on the cooling effectiveness of pin and perforated heat sinks

Abstract

In the presented numerical study, the effect of the use of mono and hybrid (CuO/Water at 2% volume concentration and CuO + Fe/Water (1% CuO + 1% Fe)) type nanofluid in heat sinks designed in new geometric structures used to increase the processor cooling performance was investigated. The geometries used are circular, triangular, square, hexagonal, square, and hexagonal, and their perforated structures and their effects on a total of eight geometries were analyzed. In addition to these, the rate of improving the temperature distribution and heat transfer in the heat sink, i.e., the Performance Evaluation Criterion (PEC), was also examined. According to the results obtained, the lowest thermal resistance value is seen in the circular cross-section with Rth = 0.289 K/W, while the highest thermal, i.e., cooling performance is seen in the triangular perforated structure with Rth = 0.63 K/W and at the lowest pressure inlet condition. In terms of temperature distribution, the most uniform distribution was obtained between 311.82 and 308.98 K in the circular section. The most interesting result in terms of the results was the PEC = 1.4 for the triangular hole structure in the heat transfer improvement performance. The main reason for this is that the range of the temperature distribution shown is very high (319–311.5K).