Li Guan , Peng Zeng , Xin Zhang , Qi Li , Yonghe Chen , Jianghui Zhai , Feng Zhang , Baozheng Yang , Xianwen Cui , Jian Ye , Shi Cheng
{"title":"The collector current model of the IGBT based on the gate charge","authors":"Li Guan , Peng Zeng , Xin Zhang , Qi Li , Yonghe Chen , Jianghui Zhai , Feng Zhang , Baozheng Yang , Xianwen Cui , Jian Ye , Shi Cheng","doi":"10.1016/j.microrel.2024.115432","DOIUrl":null,"url":null,"abstract":"<div><p>In this study, a dynamic and static collector current (I<sub>C</sub>) model of the IGBT based on the gate charge is proposed. The gate charge could be easily obtained by measuring the voltage across the gate mirror circuit capacitance, and the transconductance obtained from the I<sub>C</sub>–V<sub>GE</sub> curve is mainly used. This model does not need the device structure parameters such as doping concentration, length, and thickness, thus is low cost and highly convenient. First, the gate charge is derived by integrating the currents of the variable capacitors C<sub>GE</sub> and C<sub>GC</sub> during the turn-on and turn-off transients, and an analytical relationship between the dynamic I<sub>C</sub> and Q<sub>G</sub> is researched. Second, a static collector current I<sub>C</sub> is established, and the gate charge is obtained through current integration during the period of the Miller capacitance plateau. The influence of the temperature on the static transconductance is studied, and the accuracy of the static current model is improved. Finally, the performance of the model is optimized with various voltages, temperatures, and currents. The experimental results reveal that the proposed model achieves a collector current error of less than 5.6 % under various operating conditions, which verifies the accuracy of the proposed model.</p></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"159 ","pages":"Article 115432"},"PeriodicalIF":1.6000,"publicationDate":"2024-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271424001124","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this study, a dynamic and static collector current (IC) model of the IGBT based on the gate charge is proposed. The gate charge could be easily obtained by measuring the voltage across the gate mirror circuit capacitance, and the transconductance obtained from the IC–VGE curve is mainly used. This model does not need the device structure parameters such as doping concentration, length, and thickness, thus is low cost and highly convenient. First, the gate charge is derived by integrating the currents of the variable capacitors CGE and CGC during the turn-on and turn-off transients, and an analytical relationship between the dynamic IC and QG is researched. Second, a static collector current IC is established, and the gate charge is obtained through current integration during the period of the Miller capacitance plateau. The influence of the temperature on the static transconductance is studied, and the accuracy of the static current model is improved. Finally, the performance of the model is optimized with various voltages, temperatures, and currents. The experimental results reveal that the proposed model achieves a collector current error of less than 5.6 % under various operating conditions, which verifies the accuracy of the proposed model.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.