The collector current model of the IGBT based on the gate charge

IF 1.6 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics Reliability Pub Date : 2024-06-19 DOI:10.1016/j.microrel.2024.115432
Li Guan , Peng Zeng , Xin Zhang , Qi Li , Yonghe Chen , Jianghui Zhai , Feng Zhang , Baozheng Yang , Xianwen Cui , Jian Ye , Shi Cheng
{"title":"The collector current model of the IGBT based on the gate charge","authors":"Li Guan ,&nbsp;Peng Zeng ,&nbsp;Xin Zhang ,&nbsp;Qi Li ,&nbsp;Yonghe Chen ,&nbsp;Jianghui Zhai ,&nbsp;Feng Zhang ,&nbsp;Baozheng Yang ,&nbsp;Xianwen Cui ,&nbsp;Jian Ye ,&nbsp;Shi Cheng","doi":"10.1016/j.microrel.2024.115432","DOIUrl":null,"url":null,"abstract":"<div><p>In this study, a dynamic and static collector current (I<sub>C</sub>) model of the IGBT based on the gate charge is proposed. The gate charge could be easily obtained by measuring the voltage across the gate mirror circuit capacitance, and the transconductance obtained from the I<sub>C</sub>–V<sub>GE</sub> curve is mainly used. This model does not need the device structure parameters such as doping concentration, length, and thickness, thus is low cost and highly convenient. First, the gate charge is derived by integrating the currents of the variable capacitors C<sub>GE</sub> and C<sub>GC</sub> during the turn-on and turn-off transients, and an analytical relationship between the dynamic I<sub>C</sub> and Q<sub>G</sub> is researched. Second, a static collector current I<sub>C</sub> is established, and the gate charge is obtained through current integration during the period of the Miller capacitance plateau. The influence of the temperature on the static transconductance is studied, and the accuracy of the static current model is improved. Finally, the performance of the model is optimized with various voltages, temperatures, and currents. The experimental results reveal that the proposed model achieves a collector current error of less than 5.6 % under various operating conditions, which verifies the accuracy of the proposed model.</p></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"159 ","pages":"Article 115432"},"PeriodicalIF":1.6000,"publicationDate":"2024-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271424001124","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

In this study, a dynamic and static collector current (IC) model of the IGBT based on the gate charge is proposed. The gate charge could be easily obtained by measuring the voltage across the gate mirror circuit capacitance, and the transconductance obtained from the IC–VGE curve is mainly used. This model does not need the device structure parameters such as doping concentration, length, and thickness, thus is low cost and highly convenient. First, the gate charge is derived by integrating the currents of the variable capacitors CGE and CGC during the turn-on and turn-off transients, and an analytical relationship between the dynamic IC and QG is researched. Second, a static collector current IC is established, and the gate charge is obtained through current integration during the period of the Miller capacitance plateau. The influence of the temperature on the static transconductance is studied, and the accuracy of the static current model is improved. Finally, the performance of the model is optimized with various voltages, temperatures, and currents. The experimental results reveal that the proposed model achieves a collector current error of less than 5.6 % under various operating conditions, which verifies the accuracy of the proposed model.

查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
基于栅极电荷的 IGBT 集电极电流模型
本研究提出了基于栅极电荷的 IGBT 动态和静态集电极电流 (IC) 模型。栅极电荷可通过测量栅极镜像电路电容上的电压轻松获得,并主要使用从 IC-VGE 曲线获得的跨导。该模型不需要掺杂浓度、长度和厚度等器件结构参数,因此成本低且非常方便。首先,通过积分可变电容 CGE 和 CGC 在开通和关断瞬态过程中的电流得出栅极电荷,并研究出动态 IC 和 QG 之间的分析关系。其次,建立了静态集电极电流 IC,并通过对米勒电容高原期间的电流积分获得了栅极电荷。研究了温度对静态跨导的影响,并提高了静态电流模型的精度。最后,利用各种电压、温度和电流对模型的性能进行了优化。实验结果表明,所提出的模型在各种工作条件下的集电极电流误差均小于 5.6%,验证了所提出模型的准确性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
Microelectronics Reliability
Microelectronics Reliability 工程技术-工程:电子与电气
CiteScore
3.30
自引率
12.50%
发文量
342
审稿时长
68 days
期刊介绍: Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
期刊最新文献
Comparative study of single event upset susceptibility in the Complementary FET (CFET) and FinFET based 6T-SRAM Effects of humidity, ionic contaminations and temperature on the degradation of silicone-based sealing materials used in microelectronics Physics-of-failure based lifetime modelling for SiC based automotive power modules using rate- and temperature-dependent modelling of sintered silver Study on single-event burnout hardening with reduction of hole current density by top polysilicon diode of SOI LDMOS based on TCAD simulations An online junction temperature detection circuit for SiC MOSFETs considering threshold voltage drift compensation
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1