Log-Normal Glide and the Formation of Misfit Dislocation Networks in Heteroepitaxial ZnS on GaP

IF 3.2 2区 化学 Q2 CHEMISTRY, MULTIDISCIPLINARY Crystal Growth & Design Pub Date : 2024-07-03 DOI:10.1021/acs.cgd.4c00559
Alexandra Fonseca Montenegro, Marzieh Baan, Maryam Ghazisaeidi, Tyler J. Grassman, Roberto C. Myers
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Abstract

Scanning electron microscopy (SEM)-based electron channeling contrast imaging (ECCI) is used to observe and quantify misfit dislocation (MD) networks formed at the heteroepitaxial interface between ZnS and GaP grown by molecular beam epitaxy (MBE). Below a critical thickness of 15–20 nm, no MDs are observed. However, crystallographic features with strong dipole contrast, consistent with unexpanded dislocation half-loops, are observed prior to the formation of visible interfacial MD segments and any notable strain relaxation. At higher film thicknesses (20 to 50 nm), interfacial MD lengths increase anisotropically in the two orthogonal in-plane ⟨110⟩ line directions, threading dislocation (TD) density increases, and a roughening transition is observed from atomically smooth two-dimensional (2D) to a multistepped three-dimensional (3D) morphology, providing evidence for step edge pinning via surface terminating dislocations. The ZnS strain relaxation, calculated from the total MD content observed via ECCI, matches the average strain relaxation measured by high-resolution X-ray diffraction (HRXRD). The MD lengths are found to follow a log-normal distribution, indicating that the combined MD nucleation and TD glide processes must have a normal distribution of activation energies. The estimated TD glide velocity (vg) along [110] is almost twice that along [110], but in both directions shows a maximum as a function of film thickness, indicating an initial burst of plasticity followed by dislocation pinning.

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对数正态滑动与 GaP 上异质外延 ZnS 中错位网络的形成
基于扫描电子显微镜(SEM)的电子通道对比成像(ECCI)被用来观察和量化通过分子束外延(MBE)生长的 ZnS 和 GaP 之间的异外延界面上形成的错位(MD)网络。在 15-20 纳米的临界厚度以下,观察不到 MD。不过,在形成可见的界面 MD 段和任何明显的应变松弛之前,可以观察到具有强烈偶极对比的晶体学特征,这些特征与未扩展的位错半环一致。在薄膜厚度较高(20 至 50 nm)时,界面 MD 长度在两个正交的平面内⟨110⟩线方向上各向异性地增加,穿线位错(TD)密度增加,并观察到从原子光滑的二维(2D)向多层次的三维(3D)形态的粗化过渡,为通过表面终止位错进行阶梯边缘钉扎提供了证据。通过 ECCI 观察到的 MD 总含量计算出的 ZnS 应变松弛与高分辨率 X 射线衍射 (HRXRD) 测得的平均应变松弛相吻合。MD 长度呈对数正态分布,这表明 MD 成核和 TD 滑翔过程的活化能必须呈正态分布。沿[110]方向的估计 TD 滑动速度(vg)几乎是沿[110]方向的两倍,但在这两个方向上都显示出与薄膜厚度函数相关的最大值,这表明最初的塑性爆发之后是位错钉扎。
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来源期刊
Crystal Growth & Design
Crystal Growth & Design 化学-材料科学:综合
CiteScore
6.30
自引率
10.50%
发文量
650
审稿时长
1.9 months
期刊介绍: The aim of Crystal Growth & Design is to stimulate crossfertilization of knowledge among scientists and engineers working in the fields of crystal growth, crystal engineering, and the industrial application of crystalline materials. Crystal Growth & Design publishes theoretical and experimental studies of the physical, chemical, and biological phenomena and processes related to the design, growth, and application of crystalline materials. Synergistic approaches originating from different disciplines and technologies and integrating the fields of crystal growth, crystal engineering, intermolecular interactions, and industrial application are encouraged.
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