{"title":"Ultracompact Bandpass Filter With Multiple Transmission Zeros and Low Insertion Loss","authors":"Chenyin Zhou;Shuai Zhang;Sulei Fu;Weibiao Wang;Yu Guo","doi":"10.1109/TCPMT.2024.3420112","DOIUrl":null,"url":null,"abstract":"Two ultracompact bandpass (UCB) filters have been proposed. To the best of the authors’ knowledge, the filter I is the minimum size microwave bandpass filter ever reported. The proposed circuits successfully integrate an integrated passive device (IPD) technique-based high-Q capacitor and energy coupling circuit with a printed circuit board (PCB) substrate. By creating both separate electric and magnetic coupling path (SEMCP) and source-load coupling path, two transmission zeros (TZs) on the stopband are generated. A wide stopband suppression and good passband selectivity are achieved by this technique. New energy coupling circuits are designed to reduce energy coupling losses of the compact filters; therefore, both compact size and low insertion loss (IL) can be achieved by the filters. Two particular examples of the filter are implemented and experimentally demonstrated. The results show a filter with a size of \n<inline-formula> <tex-math>$0.55\\times 1.38$ </tex-math></inline-formula>\n mm2 (\n<inline-formula> <tex-math>$5.2\\times 10^{-4}~\\lambda _{g}^{2}$ </tex-math></inline-formula>\n at 3.7 GHz), an IL of 2.2 dB at center frequency and two TZs on the upper stopband. The other filter demonstrated with a size of \n<inline-formula> <tex-math>$2.1\\times 1.32$ </tex-math></inline-formula>\n mm2 (\n<inline-formula> <tex-math>$2.7\\times 10^{-3}~\\lambda _{g}^{2}$ </tex-math></inline-formula>\n at 4.5 GHz), an IL of 1.81 dB at the center frequency and two controllable TZs on the stopband.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 7","pages":"1240-1253"},"PeriodicalIF":2.3000,"publicationDate":"2024-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10574884/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Two ultracompact bandpass (UCB) filters have been proposed. To the best of the authors’ knowledge, the filter I is the minimum size microwave bandpass filter ever reported. The proposed circuits successfully integrate an integrated passive device (IPD) technique-based high-Q capacitor and energy coupling circuit with a printed circuit board (PCB) substrate. By creating both separate electric and magnetic coupling path (SEMCP) and source-load coupling path, two transmission zeros (TZs) on the stopband are generated. A wide stopband suppression and good passband selectivity are achieved by this technique. New energy coupling circuits are designed to reduce energy coupling losses of the compact filters; therefore, both compact size and low insertion loss (IL) can be achieved by the filters. Two particular examples of the filter are implemented and experimentally demonstrated. The results show a filter with a size of
$0.55\times 1.38$
mm2 (
$5.2\times 10^{-4}~\lambda _{g}^{2}$
at 3.7 GHz), an IL of 2.2 dB at center frequency and two TZs on the upper stopband. The other filter demonstrated with a size of
$2.1\times 1.32$
mm2 (
$2.7\times 10^{-3}~\lambda _{g}^{2}$
at 4.5 GHz), an IL of 1.81 dB at the center frequency and two controllable TZs on the stopband.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.