Pub Date : 2026-02-03DOI: 10.1109/TCPMT.2026.3657089
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Pub Date : 2026-02-03DOI: 10.1109/TCPMT.2026.3657087
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors","authors":"","doi":"10.1109/TCPMT.2026.3657087","DOIUrl":"https://doi.org/10.1109/TCPMT.2026.3657087","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"16 2","pages":"458-458"},"PeriodicalIF":3.0,"publicationDate":"2026-02-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11371450","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146102997","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-20DOI: 10.1109/TCPMT.2026.3652066
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors","authors":"","doi":"10.1109/TCPMT.2026.3652066","DOIUrl":"https://doi.org/10.1109/TCPMT.2026.3652066","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"16 1","pages":"248-248"},"PeriodicalIF":3.0,"publicationDate":"2026-01-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11359416","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146001879","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-20DOI: 10.1109/TCPMT.2026.3652068
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information","authors":"","doi":"10.1109/TCPMT.2026.3652068","DOIUrl":"https://doi.org/10.1109/TCPMT.2026.3652068","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"16 1","pages":"C3-C3"},"PeriodicalIF":3.0,"publicationDate":"2026-01-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11359418","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146001878","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-12DOI: 10.1109/TCPMT.2025.3640548
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information","authors":"","doi":"10.1109/TCPMT.2025.3640548","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3640548","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 12","pages":"C3-C3"},"PeriodicalIF":3.0,"publicationDate":"2026-01-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11345818","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145982139","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-12DOI: 10.1109/TCPMT.2025.3640546
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors","authors":"","doi":"10.1109/TCPMT.2025.3640546","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3640546","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 12","pages":"2801-2801"},"PeriodicalIF":3.0,"publicationDate":"2026-01-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11345816","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145982141","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-24DOI: 10.1109/TCPMT.2025.3626875
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information","authors":"","doi":"10.1109/TCPMT.2025.3626875","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3626875","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 11","pages":"C3-C3"},"PeriodicalIF":3.0,"publicationDate":"2025-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11264860","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145584638","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-24DOI: 10.1109/TCPMT.2025.3626873
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors","authors":"","doi":"10.1109/TCPMT.2025.3626873","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3626873","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 11","pages":"2547-2547"},"PeriodicalIF":3.0,"publicationDate":"2025-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11264838","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145584690","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-12DOI: 10.1109/TCPMT.2025.3631836
Huicheng Feng;Gongyue Tang;Xiaowu Zhang;Boon Long Lau;Ming Chinq Jong
Three-dimensional integrated circuits (3-D ICs) enable a higher level of device integration for high-performance computing but also introduce significant thermal challenges due to increased power density. This letter demonstrates a two-phase liquid cooling approach for stacked high-power chips featuring backside-embedded micro-pin fins. Deionized water is circulated directly through the chips, providing internal cooling. The results show effective thermal management, with maximum power levels of 126–140 W achieved for Chips 1 and 2. Temperature fluctuations in the two-phase regime remain minimal, confirming the approach’s practicality. Chip 2 benefits from lower temperatures and higher heat transfer coefficients due to double-side cooling by water flowing through both itself and Chip 1. Increasing the flowrate reduces the chip temperatures and improves heat transfer coefficients but incurs higher pressure drops. The coefficient of performance (COP) decreases with flowrate but improves with heat power. These findings validate the feasibility of the proposed cooling method and establish a proof of concept for further integration in 3-D IC designs.
{"title":"Two-Phase Liquid Cooling of Vertically Stacked High-Power Chips With Backside-Embedded Micro-Pin Fins","authors":"Huicheng Feng;Gongyue Tang;Xiaowu Zhang;Boon Long Lau;Ming Chinq Jong","doi":"10.1109/TCPMT.2025.3631836","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3631836","url":null,"abstract":"Three-dimensional integrated circuits (3-D ICs) enable a higher level of device integration for high-performance computing but also introduce significant thermal challenges due to increased power density. This letter demonstrates a two-phase liquid cooling approach for stacked high-power chips featuring backside-embedded micro-pin fins. Deionized water is circulated directly through the chips, providing internal cooling. The results show effective thermal management, with maximum power levels of 126–140 W achieved for Chips 1 and 2. Temperature fluctuations in the two-phase regime remain minimal, confirming the approach’s practicality. Chip 2 benefits from lower temperatures and higher heat transfer coefficients due to double-side cooling by water flowing through both itself and Chip 1. Increasing the flowrate reduces the chip temperatures and improves heat transfer coefficients but incurs higher pressure drops. The coefficient of performance (COP) decreases with flowrate but improves with heat power. These findings validate the feasibility of the proposed cooling method and establish a proof of concept for further integration in 3-D IC designs.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"16 1","pages":"244-247"},"PeriodicalIF":3.0,"publicationDate":"2025-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146001880","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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