Evaluation of nano indentation behavior of TIG, MIG and diffusion bonded Inconel 718 and austenitic Stainless Steel 316L joint interface

IF 2.7 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Letters Pub Date : 2024-07-01 DOI:10.1016/j.matlet.2024.136952
Salman Khan , Khadija , Massab Junaid , Tauheed Shehbaz , Fahd Nawaz Khan , Nida Naveed
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Abstract

The nanomechanical characteristics of Metal Inert Gas (MIG), Tungsten Inert Gas (TIG), and diffusion-bonded Inconel (IN718) and Austenitic Stainless Steel (SS 316L) were investigated. The nano hardness and elastic modulus of different weldments were evaluated using nanoindentation and compared. The results showed that intermetallic compounds (IMCs) and carbides were reduced with diffusion bonding. Moreover, maximum nano hardness and elastic modulus occurred in the welded zone (WZ) of TIG and MIG welded joints while at the bonding interface in diffusion bonding (DB). Lastly, the nano hardness of the bonding interface in diffusion-bonded was 11 % and 7 % lower compared to MIG and TIG welded joints.

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评估钨极氩弧焊、钼极氩弧焊和扩散接合 Inconel 718 与奥氏体不锈钢 316L 接头界面的纳米压痕行为
研究了金属惰性气体(MIG)、钨惰性气体(TIG)以及扩散结合铬镍铁合金(IN718)和奥氏体不锈钢(SS 316L)的纳米力学特性。采用纳米压痕法对不同焊接件的纳米硬度和弹性模量进行了评估和比较。结果表明,金属间化合物(IMC)和碳化物在扩散接合过程中减少了。此外,最大纳米硬度和弹性模量出现在 TIG 和 MIG 焊接接头的焊接区(WZ),而在扩散接合(DB)中则出现在接合界面。最后,与 MIG 和 TIG 焊点相比,扩散结合焊点结合界面的纳米硬度分别低 11 % 和 7 %。
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来源期刊
Materials Letters
Materials Letters 工程技术-材料科学:综合
CiteScore
5.60
自引率
3.30%
发文量
1948
审稿时长
50 days
期刊介绍: Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive
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