Jiahua Lyu;Hong Cai Chen;Qingsha S. Cheng;Yang Zhang;Yaping Du
{"title":"Rapid Design of Litz Wire Using Surrogate-Assisted Optimization Embedding Adjacent Trust Region","authors":"Jiahua Lyu;Hong Cai Chen;Qingsha S. Cheng;Yang Zhang;Yaping Du","doi":"10.1109/TCPMT.2024.3423003","DOIUrl":null,"url":null,"abstract":"Litz wire is essential in minimizing eddy losses in high-frequency power devices. However, accurately evaluating Litz wire impedance is challenging due to the low precision of analytical methods and the high-computational demands of numerical simulations. To address this, we propose a multifidelity surrogate-assisted optimization framework embedding with an adaptive trust region (MF-TR-SAO) that efficiently designs Litz wires through numerical simulation. This approach merges multifidelity modeling with space mapping (SM) to rapidly achieve global optimization. We validate the framework’s performance using Zakharov and Ackley functions and demonstrate its superiority over other optimization techniques. The MF-TR-SAO is then applied to the design of Litz wires comprising hundreds of strands. The optimized Litz wire design exhibits an 18%–36% performance enhancement in terms of power loss reduction compared with a conventional single-bundle wire while also considering cost-effectiveness and computational efficiency. This algorithm significantly advances Litz wire manufacturing by optimizing for power loss, cost, and design speed.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 12","pages":"2211-2219"},"PeriodicalIF":3.0000,"publicationDate":"2024-07-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10584549/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Litz wire is essential in minimizing eddy losses in high-frequency power devices. However, accurately evaluating Litz wire impedance is challenging due to the low precision of analytical methods and the high-computational demands of numerical simulations. To address this, we propose a multifidelity surrogate-assisted optimization framework embedding with an adaptive trust region (MF-TR-SAO) that efficiently designs Litz wires through numerical simulation. This approach merges multifidelity modeling with space mapping (SM) to rapidly achieve global optimization. We validate the framework’s performance using Zakharov and Ackley functions and demonstrate its superiority over other optimization techniques. The MF-TR-SAO is then applied to the design of Litz wires comprising hundreds of strands. The optimized Litz wire design exhibits an 18%–36% performance enhancement in terms of power loss reduction compared with a conventional single-bundle wire while also considering cost-effectiveness and computational efficiency. This algorithm significantly advances Litz wire manufacturing by optimizing for power loss, cost, and design speed.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.