Rapid Design of Litz Wire Using Surrogate-Assisted Optimization Embedding Adjacent Trust Region

IF 3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-07-04 DOI:10.1109/TCPMT.2024.3423003
Jiahua Lyu;Hong Cai Chen;Qingsha S. Cheng;Yang Zhang;Yaping Du
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Abstract

Litz wire is essential in minimizing eddy losses in high-frequency power devices. However, accurately evaluating Litz wire impedance is challenging due to the low precision of analytical methods and the high-computational demands of numerical simulations. To address this, we propose a multifidelity surrogate-assisted optimization framework embedding with an adaptive trust region (MF-TR-SAO) that efficiently designs Litz wires through numerical simulation. This approach merges multifidelity modeling with space mapping (SM) to rapidly achieve global optimization. We validate the framework’s performance using Zakharov and Ackley functions and demonstrate its superiority over other optimization techniques. The MF-TR-SAO is then applied to the design of Litz wires comprising hundreds of strands. The optimized Litz wire design exhibits an 18%–36% performance enhancement in terms of power loss reduction compared with a conventional single-bundle wire while also considering cost-effectiveness and computational efficiency. This algorithm significantly advances Litz wire manufacturing by optimizing for power loss, cost, and design speed.
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利用嵌入相邻信任区域的代用辅助优化技术快速设计利兹导线
在高频功率器件中,利茨丝是减少涡流损耗的关键。然而,由于分析方法的精度较低和数值模拟的高计算需求,准确评估利茨线阻抗是一项挑战。为了解决这个问题,我们提出了一个嵌入自适应信任域(MF-TR-SAO)的多保真代理辅助优化框架,该框架通过数值模拟有效地设计了Litz线。该方法将多保真度建模与空间映射(SM)相结合,快速实现全局优化。我们使用Zakharov和Ackley函数验证了该框架的性能,并证明了其优于其他优化技术。然后将MF-TR-SAO应用于包含数百股的Litz线的设计。与传统的单束线相比,优化后的Litz线设计在降低功耗方面的性能提高了18%-36%,同时也考虑了成本效益和计算效率。该算法通过优化功耗、成本和设计速度,显著提高了Litz线的制造水平。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
期刊最新文献
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information 2025 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 15 IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors
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