Compact IPD Bandpass Filters Based on Coupling-Enhanced Transformer and Metamaterial Lowpass Structure

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-07-08 DOI:10.1109/TCPMT.2024.3424783
Bukun Xu;Yazi Cao;Bo Yuan;Shichang Chen;Gaofeng Wang
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Abstract

Two compact bandpass filters (BPFs) based on the coupling-enhanced transformer and metamaterial lowpass structure are presented. The coupling-enhanced transformer is introduced to reduce the insertion loss in the desired passband. Moreover, for the first time, a new metamaterial lowpass structure is proposed to generate multiple transmission zeros (TZs) and can achieve high stopband suppression in a wide upper stopband. Its even-odd mode equivalent circuits are discussed, and its Bloch impedance and dispersion are analyzed. The first BPF operates at 1.85 GHz and the second BPF operates at 2.45 GHz, which can achieve an insertion loss of less than 1.0 and 0.8 dB, respectively. These two BPFs can achieve 30 dB attenuation from 4.7 to 7.5 GHz and 20 dB attenuation up to $7.2~f_{0}$ , respectively. Both designs have a compact size of less than $1.3\times 10^{-2}~\lambda _{0} \times 6.5\times 10^{-3}~\lambda _{0}$ . Two prototypes are fabricated using Si-based integrated passive devices (IPDs) technology and validated with measurements.
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基于耦合增强变压器和超材料低通结构的紧凑型 IPD 带通滤波器
本文介绍了两个基于耦合增强变压器和超材料低通结构的紧凑型带通滤波器(BPF)。耦合增强变压器的引入可降低所需通带内的插入损耗。此外,还首次提出了一种新的超材料低通结构,可产生多个传输零点(TZ),并能在宽上止带实现高止带抑制。我们讨论了它的偶偶模等效电路,并分析了它的布洛赫阻抗和色散。第一个 BPF 工作频率为 1.85 GHz,第二个 BPF 工作频率为 2.45 GHz,插入损耗分别小于 1.0 和 0.8 dB。这两个 BPF 在 4.7 至 7.5 GHz 频段可分别实现 30 dB 衰减,在 7.2~f_{0}$ 频段可分别实现 20 dB 衰减。这两种设计的体积均小于 1.3 (times 10^{-2}~lambda _{0} 美元)。\6.5 倍 10^{-3}~lambda _{0}$ 。利用硅基集成无源器件(IPDs)技术制造了两个原型,并通过测量进行了验证。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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