Molecular interactions in Copper chemical mechanical planarization: A Phenomenological study

IF 1.8 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY ECS Journal of Solid State Science and Technology Pub Date : 2024-07-06 DOI:10.1149/2162-8777/ad5fe4

Mahadevaiyer Krishnan, Donald Capaneri, Sarukkai K Rangarajan

{"title":"Molecular interactions in Copper chemical mechanical planarization: A Phenomenological study","authors":"Mahadevaiyer Krishnan, Donald Capaneri, Sarukkai K Rangarajan","doi":"10.1149/2162-8777/ad5fe4","DOIUrl":null,"url":null,"abstract":"\n Abstract In this study, the molecular interactions occurring during Chemical Mechanical planarization of Copper in Ferric nitrate – Alumina – Benzotriazole system is investigated. This system is characterized by sudden and dramatic transitions in removal rates when experimental parameters such as downforce and concentrations of the slurry components (Benzotriazole, abrasive, oxidizer) are varied. This behavior is interpreted in terms of the three surface kinetic processes viz. Cu dissolution, film formation and film removal by abrasion, that determine the overall removal rate. A phenomenological model incorporating Frumkin isotherm for the adsorption of Benzotriazole molecules and Langmuir isotherm for the adsorption of surfactants/ions is proposed. Mathematical equations relating the rates of film formation, film removal and metal dissolution to the over all removal rates are derived. The Model is validated by comparing the model predictions with experimental data. The non-linear equations describing the sudden transitions are shown to exhibit a cusp catastrophe when the interaction parameter exceeds a certain value.","PeriodicalId":11496,"journal":{"name":"ECS Journal of Solid State Science and Technology","volume":null,"pages":null},"PeriodicalIF":1.8000,"publicationDate":"2024-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ECS Journal of Solid State Science and Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1149/2162-8777/ad5fe4","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}

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Abstract

Abstract In this study, the molecular interactions occurring during Chemical Mechanical planarization of Copper in Ferric nitrate – Alumina – Benzotriazole system is investigated. This system is characterized by sudden and dramatic transitions in removal rates when experimental parameters such as downforce and concentrations of the slurry components (Benzotriazole, abrasive, oxidizer) are varied. This behavior is interpreted in terms of the three surface kinetic processes viz. Cu dissolution, film formation and film removal by abrasion, that determine the overall removal rate. A phenomenological model incorporating Frumkin isotherm for the adsorption of Benzotriazole molecules and Langmuir isotherm for the adsorption of surfactants/ions is proposed. Mathematical equations relating the rates of film formation, film removal and metal dissolution to the over all removal rates are derived. The Model is validated by comparing the model predictions with experimental data. The non-linear equations describing the sudden transitions are shown to exhibit a cusp catastrophe when the interaction parameter exceeds a certain value.

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铜化学机械平面化中的分子相互作用：现象学研究

摘要本研究调查了硝酸铁-氧化铝-苯并三唑体系中铜的化学机械平面化过程中发生的分子相互作用。该体系的特点是，当下压力和浆料成分（苯并三唑、研磨剂、氧化剂）浓度等实验参数发生变化时，去除率会发生突然而剧烈的变化。这种行为可通过三个表面动力学过程（即铜溶解、膜形成和膜被磨蚀去除）来解释，这三个过程决定了总体去除率。提出了一个现象学模型，其中包括苯并三唑分子吸附的弗鲁姆金等温线和表面活性剂/离子吸附的朗缪尔等温线。得出了将薄膜形成率、薄膜去除率和金属溶解率与总去除率相关联的数学公式。通过将模型预测值与实验数据进行比较，对模型进行了验证。结果表明，当相互作用参数超过一定值时，描述突然转变的非线性方程会出现尖顶灾难。

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来源期刊

ECS Journal of Solid State Science and Technology MATERIALS SCIENCE, MULTIDISCIPLINARY-PHYSICS, APPLIED

CiteScore

4.50

自引率

13.60%

发文量

455

期刊介绍： The ECS Journal of Solid State Science and Technology (JSS) was launched in 2012, and publishes outstanding research covering fundamental and applied areas of solid state science and technology, including experimental and theoretical aspects of the chemistry and physics of materials and devices. JSS has five topical interest areas: carbon nanostructures and devices dielectric science and materials electronic materials and processing electronic and photonic devices and systems luminescence and display materials, devices and processing.