Nested Latin Hypercube-Based Sampling for Efficient Uncertainty Quantification Using Sensitivity-Assisted Least Squares SVM

IF 3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-07-15 DOI:10.1109/TCPMT.2024.3428404
Karanvir S. Sidhu;Roni Khazaka
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Abstract

Recently, a methodology to use the sensitivity information for building the least squares support vector machine (LS-SVM)-based surrogate model for uncertainty quantification in the context of circuit systems was proposed. It was shown that the sensitivity-enhanced LS-SVM could successfully reduce the simulation data required for building LS-SVM-based surrogate models. However, the number of samples required for building the surrogate models is not known a priori. In this article, we present an iterative technique that uses the nested Latin hypercubes to add the samples until the surrogate model achieves the desired accuracy. The presented technique is demonstrated using two numerical examples, where we show that the proposed method can significantly reduce the amount of simulation data required for building LS-SVM-based surrogate models.
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利用灵敏度辅助最小二乘法 SVM 进行基于嵌套拉丁超立方体的高效不确定性量化采样
最近,提出了一种利用灵敏度信息建立基于最小二乘支持向量机(LS-SVM)的替代模型的方法,用于电路系统的不确定性量化。结果表明,灵敏度增强的LS-SVM可以成功地减少构建基于LS-SVM的代理模型所需的仿真数据。然而,构建代理模型所需的样本数量是未知的。在本文中,我们介绍了一种迭代技术,它使用嵌套的拉丁超立方体来添加样本,直到代理模型达到所需的精度。通过两个数值示例证明了所提出的技术,其中我们表明所提出的方法可以显着减少构建基于ls - svm的代理模型所需的仿真数据量。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
期刊最新文献
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information 2025 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 15 IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors
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