Unified multifunctional-reconfigurable architecture for device-circuit co-design

IF 1.9 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics Journal Pub Date : 2024-07-18 DOI:10.1016/j.mejo.2024.106329
Gagan, Akansha Aggarwal
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Abstract

In this article, we propose a novel unified device-circuit co-design for functional scalability and diversifiability within the same footprint. The proposed design comprises two L-shaped NMOS monolithically integrated with two L-shaped PMOS utilizing common silicon reservoir with charge-plasma (CP) induced source and drain regions. The CP regions are induced by choosing appropriate work functions for the metal electrodes using calibrated TCAD simulations. Through source-drain interchangeability among individual transistors and appropriate signal bias, we have demonstrated the possible reconfigurations of the proposed single architecture to perform various device and/or circuit level operations concurrently/separately. For device level analyses, we realized concurrent NMOS and PMOS in single-channel and/or dual-channel configurations. Further, for circuit level analyses, we realized a CMOS inverter in addition to an NMOS and a PMOS, all three operating independently. Next, we demonstrated two independent inverters with possible realization of a buffer. Lastly, we present NAND and NOR Gates, each in two possible configurations, obtained through the proposed single-device architecture.

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用于器件-电路协同设计的多功能可配置统一架构
在本文中,我们提出了一种新颖的统一器件-电路协同设计,可在相同的基底面上实现功能的可扩展性和多样化。所提出的设计包括两个 L 型 NMOS 和两个 L 型 PMOS,利用带有电荷等离子体(CP)诱导源区和漏区的共用硅槽进行单片集成。通过校准 TCAD 仿真为金属电极选择适当的功函数来诱导 CP 区域。通过单个晶体管之间的源漏互换性和适当的信号偏置,我们展示了所建议的单一架构的可能重新配置,以同时/单独执行各种器件和/或电路级操作。在器件级分析方面,我们在单通道和/或双通道配置中实现了并发 NMOS 和 PMOS。此外,在电路级分析中,除了 NMOS 和 PMOS 外,我们还实现了 CMOS 逆变器,所有三个逆变器均可独立运行。接下来,我们演示了两个独立的反相器,并可能实现一个缓冲器。最后,我们介绍了 NAND 和 NOR 门,每种门都有两种可能的配置,它们都是通过建议的单器件架构实现的。
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来源期刊
Microelectronics Journal
Microelectronics Journal 工程技术-工程:电子与电气
CiteScore
4.00
自引率
27.30%
发文量
222
审稿时长
43 days
期刊介绍: Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.
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