{"title":"Transient Liquid Phase Bond Acceleration Using Copper Nanowires","authors":"John Harris, David R. Huitink","doi":"10.1115/1.4066042","DOIUrl":null,"url":null,"abstract":"\n Increasing heat flux in power electronics modules is taxing the limits of thermal management technologies. This is the result of wide bandgap semiconductor devices with superior voltage blocking capabilities. These same devices have the capability of operating at elevated junction temperatures when properly packaged. Transient liquid phase bonding forms intermetallic compounds with high melting temperatures at more conventional processing temperatures. Copper and tin transient liquid phase intermetallic formation in SAC305 solder bonds can be accelerated using copper nanowires. This work explores the feasibility of accelerated transient liquid phase bonding using solder and nanowires. This includes electroforming of nanowires, contact angle analysis of solder on nanowires, void analysis using scanning acoustic microscopy and cross-sectional scanning electron microscopy. SAC305 solder is deposited on substrates with 0.4 µm diameter copper nanowires using a 75µm stencil and subjected to solder reflow. It is found that atmospheric storage at 260 °C results in regions of complete intermetallic bonding after 2 hours. Shear strength of bonds completed with this nanowire transient liquid phase bonding method averages 11.99 kg or 13 MPa.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":null,"pages":null},"PeriodicalIF":2.2000,"publicationDate":"2024-07-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Packaging","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1115/1.4066042","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Increasing heat flux in power electronics modules is taxing the limits of thermal management technologies. This is the result of wide bandgap semiconductor devices with superior voltage blocking capabilities. These same devices have the capability of operating at elevated junction temperatures when properly packaged. Transient liquid phase bonding forms intermetallic compounds with high melting temperatures at more conventional processing temperatures. Copper and tin transient liquid phase intermetallic formation in SAC305 solder bonds can be accelerated using copper nanowires. This work explores the feasibility of accelerated transient liquid phase bonding using solder and nanowires. This includes electroforming of nanowires, contact angle analysis of solder on nanowires, void analysis using scanning acoustic microscopy and cross-sectional scanning electron microscopy. SAC305 solder is deposited on substrates with 0.4 µm diameter copper nanowires using a 75µm stencil and subjected to solder reflow. It is found that atmospheric storage at 260 °C results in regions of complete intermetallic bonding after 2 hours. Shear strength of bonds completed with this nanowire transient liquid phase bonding method averages 11.99 kg or 13 MPa.
期刊介绍：
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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