Combining Prior Knowledge with Transfer Learning (PKID-TL) for Fast Neural Network Enabled Uncertainty Quantification of Graphene On-Chip Interconnects
Surila Guglani, Asha Kumari Jakhar, Avirup Dasgupta, Sourajeet Roy
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IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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