Compact Self-Shielding Components for Beamforming Networks Implemented in Substrate Integrated Coaxial Line Technology

IF 3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-08-01 DOI:10.1109/TCPMT.2024.3436545
Laura Van Messem;Arno Moerman;Olivier Caytan;Hendrik Rogier;Sam Lemey
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Abstract

A substrate integrated coaxial line (SICL) technology implemented in standard printed circuit board (PCB) technology is proposed to realize shielded miniaturized millimeterwave (mmWave) components, eliminating spurious feed network radiation that may influence the antenna array’s radiation pattern. Additionally, coupling to neighboring signal lines is avoided by the self-packaging characteristic of SICL lines, thereby minimizing undesired crosstalk in the routing network. A thorough comparison to more traditional transmission lines, such as grounded co-planar waveguides (GCPWs), shows excellent packaging behavior by minimizing radiation and increasing the routing flexibility between the compact functional components. Further validation of this technology is done by implementing several essential components for beamforming networks: a coaxial via transition, a packaged hybrid coupler and an improved, miniaturized hybrid coupler with direct interfacing. The proposed shielded coaxial via transition from SICL to SICL exhibits a measured insertion loss smaller than 0.74 dB in a broad operational frequency range from 23.75 to 32.5 GHz (31%), covering the n257, n258, and n261 5G bands. In this frequency range, the (miniaturized) SICL hybrid coupler has a measured amplitude imbalance (AI) below 1 dB (0.8 dB) and the phase imbalance does not exceed 6° (3°). The proposed miniaturized SICL hybrid coupler has a footprint of only 4 mm in diameter.
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利用基底集成同轴线技术实现波束成形网络的紧凑型自屏蔽组件
提出了一种在标准印刷电路板(PCB)技术中实现的基板集成同轴线(SICL)技术,以实现屏蔽小型化毫米波(mmWave)元件,消除可能影响天线阵列辐射方向图的杂散馈电网络辐射。此外,SICL线的自封装特性避免了与相邻信号线的耦合,从而最大限度地减少了路由网络中不希望的串扰。与更传统的传送线(如接地共面波导(gcpw))进行彻底的比较,通过最大限度地减少辐射和增加紧凑功能组件之间的路由灵活性,显示出出色的封装性能。该技术的进一步验证是通过实现波束形成网络的几个基本组件来完成的:同轴通过过渡,封装的混合耦合器和改进的,小型化的直接接口混合耦合器。通过从SICL过渡到SICL的屏蔽同轴在23.75至32.5 GHz的宽工作频率范围内(31%)显示出小于0.74 dB的测量插入损耗,覆盖了n257, n258和n261 5G频段。在该频率范围内,(小型化)SICL混合耦合器的测量幅度不平衡(AI)低于1 dB (0.8 dB),相位不平衡不超过6°(3°)。提出的小型化SICL混合耦合器的直径只有4毫米的足迹。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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