Enhanced Thermal Management in Microelectronics Packaging With 2D h‐BN Nanocomposite Underfills

Abstract

The quest for faster and more densely packed microelectronic circuits has necessitated significant advancements in thermal management and encapsulant manufacturing technologies. This pursuit has driven the development of innovative methods to enhance heat flux and thermal transfer in microelectronics packaging. A critical issue is the thermal stress induced by the coefficient of thermal expansion (CTE) mismatch between the chip and the substrate, threatening the chip's mechanical integrity and lifespan. To address this challenge, there is a growing emphasis on using underfills to improve thermal transfer and heat dissipation. The current study focuses on using hexagonal boron nitride (h‐BN) nanofillers for robust thermal support in microelectronics packaging. This study deploys epoxy adhesives to integrate nanofillers, where precise dispersion is crucial for optimizing thermal and mechanical properties. Findings show 1500‐ and 500‐nm h‐BN enhance axial thermal conductivity and diffusivity linearly with filler content, while the 70‐nm h‐BN plateaus at 3% volume. The 70‐nm h‐BN demonstrates superior radial thermal performance.