Packaged 5G Filter With Miniaturization and Wide Stopband Based on Shielded Stripline Resonator

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-08-05 DOI:10.1109/TCPMT.2024.3430936
Danyu Yang;Yuandan Dong
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Abstract

The study presents a self-packaged bandpass filter (BPF) with miniaturization and wide stopband based on shielded stripline resonators using a mixed coupling scheme. First, the miniaturized effect and the field distribution at fundamental and spurious modes of a single resonator are analyzed. Then, a mixed coupling scheme is applied to two coupled resonators for spurious passband suppression to achieve wide stopband, which is verified by the second-order BPF response. Finally, shielded stripline resonators with a mixed coupling scheme are further applied to the design of the fourth-order 5G N78 band BPF. The final self-packaged fourth-order BPF achieves an extremely small volume of $0.144\times 0.139\times 0.025\lambda 3$ g, whose stopband is extended up to 5.11f0 with a rejection level better than 20 dB or 3.37f0 with a rejection better than 50 dB.
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基于屏蔽带状线谐振器的 5G 小型化宽阻带封装滤波器
本研究介绍了一种基于屏蔽条纹谐振器的自封装带通滤波器(BPF),该滤波器采用混合耦合方案,具有小型化和宽阻带的特点。首先,分析了单个谐振器的小型化效应以及基模和杂散模的场分布。然后,将混合耦合方案应用于两个耦合谐振器,以抑制杂散通带,从而实现宽阻带,并通过二阶 BPF 响应验证了这一点。最后,采用混合耦合方案的屏蔽条纹谐振器被进一步应用到四阶 5G N78 频带 BPF 的设计中。最终的自封装四阶BPF体积极小,仅为0.144/times 0.139/times 0.025\lambda 3$ g,其阻带可扩展至5.11f0,抑制水平优于20 dB,或3.37f0,抑制水平优于50 dB。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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Table of Contents Front Cover Table of Contents Front Cover IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
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