A Novel and Compact Centrosymmetric EBG Structure for Multiband Power Noise Suppression

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-08-05 DOI:10.1109/TCPMT.2024.3438763
Da-Lin Li;Mu-Shui Zhang;Zi-Xin Wang
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Abstract

In this article, a novel and compact centrosymmetric mushroom electromagnetic bandgap (EBG) structure is proposed for multiband power noise suppression. Different mushroom patches are integrated in a compact unit cell in a centrosymmetric pattern to generate multiple stopbands. The stopbands can be easily designed and adjusted by the area ratio of different subpatches and scaling. The most obvious advantages of the proposed method are compact in structure and easy in design, especially for tri-band and four-band stopband power noise suppression. EBG structures with double bands, treble bands, and four bands are designed and fabricated. Measurements and simulations are performed to verify the multiband characteristic, and good agreement is observed. This structure provides a simple, compact, and attractive solution for multiband power noise suppression with more than three bands.
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用于抑制多频段功率噪声的新型紧凑型中心对称 EBG 结构
本文提出了一种用于多频带功率噪声抑制的新型紧凑型中心对称蘑菇电磁带隙(EBG)结构。不同的蘑菇贴片以中心对称的模式集成在一个紧凑的单元格中,从而产生多个阻带。通过不同子贴片的面积比和缩放,可以轻松设计和调整止带。该方法最明显的优点是结构紧凑、易于设计,尤其适用于三频带和四频带止带功率噪声抑制。我们设计并制作了双频、高频和四频 EBG 结构。通过测量和仿真验证了多频带特性,并观察到良好的一致性。这种结构为三个以上频带的多频带功率噪声抑制提供了一种简单、紧凑和有吸引力的解决方案。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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