TC-GVF: Tensor Core GPU-Based Vector Fitting via Accelerated Tall-Skinny QR Solvers

IF 3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-06-11 DOI:10.1109/TCPMT.2024.3410298
Vinay Kukutla;Ramachandra Achar;Wai-Kong Lee
{"title":"TC-GVF: Tensor Core GPU-Based Vector Fitting via Accelerated Tall-Skinny QR Solvers","authors":"Vinay Kukutla;Ramachandra Achar;Wai-Kong Lee","doi":"10.1109/TCPMT.2024.3410298","DOIUrl":null,"url":null,"abstract":"QR decomposition and solution of linear least-squares-based large system of equations form the backbone of computational flow in many scientific applications. Usually, these account for the bulk of the computational cost in these applications, such as in vector fitting (VF) methods, which are widely used for system identification via rational function approximation from tabulated data of high-speed modules. Since the VF algorithm is iterative in nature, minimizing its computational cost and increasing its parallel efficiency on mixed CPU and GPU environments are critical in reducing the time needed for each iteration. In this article, a novel tensor core-based QR (TC-QR) decomposition method and tensor core-based linear least-squares-based solver (TC-LLS) are introduced to speed up the computationally expensive steps of QR factorization and solution to a set of linear least-squares equations, exploiting the emerging GPU platforms with tensor core (TC) architectures. These modules are utilized in developing the TC GPU-based VF (TC-GVF) algorithm, providing significant speedup compared with the state-of-the-art GVF implementations in the literature.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"54-63"},"PeriodicalIF":3.0000,"publicationDate":"2024-06-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10553395/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

QR decomposition and solution of linear least-squares-based large system of equations form the backbone of computational flow in many scientific applications. Usually, these account for the bulk of the computational cost in these applications, such as in vector fitting (VF) methods, which are widely used for system identification via rational function approximation from tabulated data of high-speed modules. Since the VF algorithm is iterative in nature, minimizing its computational cost and increasing its parallel efficiency on mixed CPU and GPU environments are critical in reducing the time needed for each iteration. In this article, a novel tensor core-based QR (TC-QR) decomposition method and tensor core-based linear least-squares-based solver (TC-LLS) are introduced to speed up the computationally expensive steps of QR factorization and solution to a set of linear least-squares equations, exploiting the emerging GPU platforms with tensor core (TC) architectures. These modules are utilized in developing the TC GPU-based VF (TC-GVF) algorithm, providing significant speedup compared with the state-of-the-art GVF implementations in the literature.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
TC-GVF:通过加速高瘦QR求解器实现基于张量核心GPU的矢量拟合
基于线性最小二乘的大方程组的QR分解和求解构成了许多科学应用中计算流的主干。通常,在这些应用中,这些占了大部分的计算成本,例如在矢量拟合(VF)方法中,它被广泛用于通过从高速模块的表列数据中通过有理函数近似进行系统识别。由于VF算法本质上是迭代的,因此最小化其计算成本并提高其在CPU和GPU混合环境下的并行效率对于减少每次迭代所需的时间至关重要。本文引入了一种新的基于张量核的QR分解方法(TC-QR)和基于张量核的线性最小二乘求解器(TC- lls),利用新兴的具有张量核(TC)架构的GPU平台,加快了QR分解和求解一组线性最小二乘方程的计算昂贵步骤。这些模块用于开发基于TC gpu的VF (TC-GVF)算法,与文献中最先进的GVF实现相比,提供了显着的加速。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
期刊最新文献
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information 2025 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 15 IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1