Most Tauhida Tabassum, Yusuke Nakagawa and Fumiyoshi Tochikubo
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引用次数: 0
Abstract
The decomposition of Cu-Ethylenediaminetetraacetic Acid (Cu-EDTA) using a pulsed streamer discharge in contact with liquid is reported under various experimental conditions, and the efficacy of OH radicals is investigated. The change in Cu-EDTA concentration was characterized using high-performance liquid chromatography. H2O2, NO2−, NO3−, and O3 were detected using water inspection test kits and an UV-visual spectrophotometer. The OH yield was estimated using a colorimetric method with disodium terephthalate. The results revealed that approximately 70% of the Cu-EDTA decomposed with an energy efficiency of 15 mmol kWh−1 in the Ar discharge, whereas the decomposition rate and energy efficiency in the air discharge were 80% and 16 mmol kWh−1, respectively, within 60 min of treatment. The decomposition in Ar was primarily driven by the OH generated during discharge, whereas a combined effect of O3 and OH was observed during air discharge. The discharge-generated OH was the dominant species in Cu-EDTA decomposition in this study.
期刊介绍:
The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP).
JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields:
• Semiconductors, dielectrics, and organic materials
• Photonics, quantum electronics, optics, and spectroscopy
• Spintronics, superconductivity, and strongly correlated materials
• Device physics including quantum information processing
• Physics-based circuits and systems
• Nanoscale science and technology
• Crystal growth, surfaces, interfaces, thin films, and bulk materials
• Plasmas, applied atomic and molecular physics, and applied nuclear physics
• Device processing, fabrication and measurement technologies, and instrumentation
• Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS