{"title":"Synergistic thermal and hydrodynamic effects in 3D-printed heat sinks with intricate microchannel patterns","authors":"Win-Jet Luo, Pramod Vishwakarma, Bivas Panigrahi","doi":"10.1007/s10404-024-02751-x","DOIUrl":null,"url":null,"abstract":"<div><p>A compelling solution to the issue of high heat flux generated by flexible electronic devices has been found in liquid-based microfluidic cooling devices. It has been earlier realized that the varying microchannel hydrodynamics influences the overall heat transfer in these devices. However, microfluidic cooling devices that incorporate intricate microchannels have not been explored to their full potential. In this study, we investigate the use of 3-D intricate microchannel geometries in microfluidic heat sinks, their generated hydrodynamics, and their profound impact on the overall heat transfer process. Utilizing 3D-printed scaffold removal technology, three distinct microfluidic devices were fabricated, each distinguishable by its cross-sectional shape of the microchannel designs (coil, square, and triangle). These microfluidic devices, based on Polydimethylsiloxane-Graphene oxide (PDMS-GO) as substrate material, have been examined experimentally and numerically for their heat dissipation capacities under constant temperature heat source of 358 K at flow rates ranging from 40 to 400 μL/min. Experimental observation illustrates that the coil-microchannel configuration exhibited superior heat dissipation capabilities, outperforming both the square and triangle microchannels across all flow settings. Furthermore, numerical simulations corroborated this experimental finding by providing insights into through-plane temperature distribution, heat transfer coefficient, pressure drop, and channel hydrodynamics. Our study intends to advance the understanding of microchannel cooling, as well as emphasizes the importance of geometrical configuration towards optimal electronic hotspot cooling.</p></div>","PeriodicalId":706,"journal":{"name":"Microfluidics and Nanofluidics","volume":null,"pages":null},"PeriodicalIF":2.3000,"publicationDate":"2024-08-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microfluidics and Nanofluidics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10404-024-02751-x","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"INSTRUMENTS & INSTRUMENTATION","Score":null,"Total":0}
引用次数: 0
Abstract
A compelling solution to the issue of high heat flux generated by flexible electronic devices has been found in liquid-based microfluidic cooling devices. It has been earlier realized that the varying microchannel hydrodynamics influences the overall heat transfer in these devices. However, microfluidic cooling devices that incorporate intricate microchannels have not been explored to their full potential. In this study, we investigate the use of 3-D intricate microchannel geometries in microfluidic heat sinks, their generated hydrodynamics, and their profound impact on the overall heat transfer process. Utilizing 3D-printed scaffold removal technology, three distinct microfluidic devices were fabricated, each distinguishable by its cross-sectional shape of the microchannel designs (coil, square, and triangle). These microfluidic devices, based on Polydimethylsiloxane-Graphene oxide (PDMS-GO) as substrate material, have been examined experimentally and numerically for their heat dissipation capacities under constant temperature heat source of 358 K at flow rates ranging from 40 to 400 μL/min. Experimental observation illustrates that the coil-microchannel configuration exhibited superior heat dissipation capabilities, outperforming both the square and triangle microchannels across all flow settings. Furthermore, numerical simulations corroborated this experimental finding by providing insights into through-plane temperature distribution, heat transfer coefficient, pressure drop, and channel hydrodynamics. Our study intends to advance the understanding of microchannel cooling, as well as emphasizes the importance of geometrical configuration towards optimal electronic hotspot cooling.
期刊介绍:
Microfluidics and Nanofluidics is an international peer-reviewed journal that aims to publish papers in all aspects of microfluidics, nanofluidics and lab-on-a-chip science and technology. The objectives of the journal are to (1) provide an overview of the current state of the research and development in microfluidics, nanofluidics and lab-on-a-chip devices, (2) improve the fundamental understanding of microfluidic and nanofluidic phenomena, and (3) discuss applications of microfluidics, nanofluidics and lab-on-a-chip devices. Topics covered in this journal include:
1.000 Fundamental principles of micro- and nanoscale phenomena like,
flow, mass transport and reactions
3.000 Theoretical models and numerical simulation with experimental and/or analytical proof
4.000 Novel measurement & characterization technologies
5.000 Devices (actuators and sensors)
6.000 New unit-operations for dedicated microfluidic platforms
7.000 Lab-on-a-Chip applications
8.000 Microfabrication technologies and materials
Please note, Microfluidics and Nanofluidics does not publish manuscripts studying pure microscale heat transfer since there are many journals that cover this field of research (Journal of Heat Transfer, Journal of Heat and Mass Transfer, Journal of Heat and Fluid Flow, etc.).