Investigation on the surface damage mechanism of single-crystal γ-TiAl alloy with pore defects based on nanocutting

IF 3.8 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Vacuum Pub Date : 2024-09-03 DOI:10.1016/j.vacuum.2024.113613
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Abstract

The γ-TiAl alloy is highly regarded as one of the most promising materials in the aerospace industry. Nonetheless, pore defects are an unavoidable challenge during its manufacturing process. To thoroughly examine the impact of these defects on the surface damage mechanism during the nanometric cutting of γ-TiAl alloy, this study utilizes molecular dynamics (MD) simulations to analyze the nanometric cutting of single-crystal γ-TiAl alloy containing pore defects. The research explores the influence of various cutting parameters and pore defect radii on cutting forces, atomic migration and surface morphology, stress and strain, sub-surface defect evolution and atomic phase transformation, and dislocation dynamics, with the goal of clarifying the surface damage mechanisms in nanometric cutting.The findings indicate that as the pore defect radius increases, the disparity between Fx and Fz becomes more pronounced, the Von Mises stress within the chip decreases, and the thickness of the sub-surface defect structure layer diminishes. When the pore defect radius is 15 Å, a "shear-off" phenomenon is observed on the cutting surface, with Fx values ranging from 2.5 to 7 times those of Fz. An increase in cutting depth results in a broader side flow width of the surface chip, raising the proportion of atoms from layers without pore defects within the chip. At a cutting depth of 20 Å, the matrix with larger pore defects shows a distinct strain distribution profile. The atomic structure of the matrix primarily consists of FCC-structured atoms.At high cutting speeds, when the pore defect radius is 10 Å, an increase in cutting depth from 10 Å to 30 Å leads to a 7.9 % rise in amorphous structure atoms. During the cutting process, dislocations predominantly occur in the shear slip zone and near the pore defects. At a cutting speed of 50 m/s and a cutting depth of 10 Å, the density of 1/6<112>(Shockley) dislocations for a pore defect size of 15 Å is 2.24 times that of a 10 Å defect; at a cutting depth of 30 Å, the density of 1/6<112>(Shockley) dislocations for a 10 Å pore defect is 2.15 times that of a 15 Å defect.

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基于纳米切削的具有孔隙缺陷的单晶 γ-TiAl 合金表面损伤机理研究
γ-TiAl合金被高度评价为航空航天工业中最有前途的材料之一。然而,孔隙缺陷是其制造过程中不可避免的挑战。为了深入研究这些缺陷对γ-TiAl 合金纳米切割过程中表面损伤机制的影响,本研究利用分子动力学(MD)模拟分析了含有孔隙缺陷的单晶γ-TiAl 合金的纳米切割。研究探讨了各种切削参数和孔隙缺陷半径对切削力、原子迁移和表面形貌、应力和应变、次表面缺陷演变和原子相变以及位错动力学的影响,旨在阐明纳米切削中的表面损伤机理。当孔隙缺陷半径为 15 Å 时,切削表面会出现 "剪断 "现象,Fx 值是 Fz 值的 2.5 到 7 倍。切割深度的增加导致表面切屑的侧流宽度变宽,提高了切屑中来自无孔隙缺陷层的原子比例。在切割深度为 20 Å 时,具有较大孔隙缺陷的基体显示出明显的应变分布曲线。在高速切割时,当孔隙缺陷半径为 10 Å 时,切割深度从 10 Å 增加到 30 Å 会导致无定形结构原子的比例增加 7.9%。在切割过程中,位错主要发生在剪切滑移区和孔隙缺陷附近。在切割速度为 50 m/s 和切割深度为 10 Å 时,孔隙缺陷大小为 15 Å 的 1/6<112>(Shockley) 位错密度是 10 Å 缺陷的 2.24 倍;在切割深度为 30 Å 时,10 Å 孔隙缺陷的 1/6<112>(Shockley) 位错密度是 15 Å 缺陷的 2.15 倍。
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来源期刊
Vacuum
Vacuum 工程技术-材料科学:综合
CiteScore
6.80
自引率
17.50%
发文量
0
审稿时长
34 days
期刊介绍: Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.
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