Jan Steven Van Dokkum , Francesc Pérez-Ràfols , Lucia Nicola
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引用次数: 0
Abstract
The Maugis analysis is applied to adhesive contact between a cylinder with various wave profiles and a semi-infinite, elastic half-plane. We extend the analysis of Waters, Lee and Guduru, who consider the adhesive contact of a Hertzian indenter on a semi-infinite, elastic half-space with axi-symmetric, wave profiles. This work gives the closed-form contact mechanical solution for continuous, line contact without the need for any approximation. The resulting semi-analytical model serves to complement existing (numerical) models of adhesive line contact with the static load-area response as a reference. Herewith we analyse adhesion-induced loading-unloading hysteresis and contrast semi-analytical and numerical result to assess the limit of the former analysis. We confirm that roughness-induced dissipation vanishes with increasing wave roughness and decreasing Maugis parameter due to an increase in the range of adhesion and cavitation. Instability and cavitation are mutually exclusive at a given load-area locus yet occur successively in the same contact. An interesting result is that the Johnson parameter, that is known to govern the amplification of adhesion in the JKR-limit, bounds the load-area envelope irrespective of Maugis parameter. However, the Johnson parameter does not control the occurrence of roughness-induced dissipation and thus interface toughening.
期刊介绍:
The International Journal of Solids and Structures has as its objective the publication and dissemination of original research in Mechanics of Solids and Structures as a field of Applied Science and Engineering. It fosters thus the exchange of ideas among workers in different parts of the world and also among workers who emphasize different aspects of the foundations and applications of the field.
Standing as it does at the cross-roads of Materials Science, Life Sciences, Mathematics, Physics and Engineering Design, the Mechanics of Solids and Structures is experiencing considerable growth as a result of recent technological advances. The Journal, by providing an international medium of communication, is encouraging this growth and is encompassing all aspects of the field from the more classical problems of structural analysis to mechanics of solids continually interacting with other media and including fracture, flow, wave propagation, heat transfer, thermal effects in solids, optimum design methods, model analysis, structural topology and numerical techniques. Interest extends to both inorganic and organic solids and structures.