Effect of Structures with Structured Surface Pad on Material Removal Rate in Chemical Mechanical Polishing

Abstract

We investigated the impact of the designed contact area (DCA) and designed contact length (DCL) on material removal rates (MRR) when using a pad with a structured surface in chemical mechanical polishing. The structure of the structured surface pad (SSP) was precisely defined, and an examination was conducted to assess the influence of variations in the shape, size, and spacing of the unit figure (UF) on the MRR. The results revealed that maintaining the DCA constant while altering the UF shape to extend the DCL led to a 203% increase in the MRR. Furthermore, modifications in the UF size enhanced the MRR by approximately 630%. The relationship between the DCL and MRR was dependent on the DCA. The characteristics of the SSP, particularly the concentrated pressure and involvement of slurry particles at the edges of the contact area, indicated that an increase in the DCL could augment the active slurry particles. This study offers valuable insights into the pad figure structure, simultaneously advancing our understanding of the pad surface topography and its influence on material removal. By focusing on both structural engineering and practical applications, this study paves the way for future research and enables further exploration in this field.