Enhancement of W Nanoparticles Synthesis by Injecting H2 in a Magnetron Sputtering Gas Aggregation Cluster Source Operated in Ar

IF 2.6 3区物理与天体物理 Q3 ENGINEERING, CHEMICAL Plasma Chemistry and Plasma Processing Pub Date : 2024-09-03 DOI:10.1007/s11090-024-10499-z

Tomy Acsente, Silviu Daniel Stoica, Cristina Craciun, Bogdana Mitu, Gheorghe Dinescu

引用次数: 0

Abstract

Synthesis of W nanoparticles by magnetron sputtering combined with gas aggregation operated in Ar suffers from a continuous decrease of the synthesis rate, ceasing in a finite time interval, in the range of minutes to tens of minutes. Experimentally, we noticed that adding small amounts of H₂ to Ar (5–20%) increases the synthesis rate, which remains constant over time, at a value dependent on the amount of injected hydrogen. Mass spectrometry investigations revealed, in the hydrogen presence, a dominance of the ArH⁺ ions over the Ar⁺ ones, associated also with an increased number of W⁺ and WH⁺ species in plasma, sustaining a substantial increase in the nucleation rate.

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在氩气环境下运行的磁控溅射气体聚集簇源中注入 H2，提高 W 纳米粒子的合成效率

在氩气中通过磁控溅射结合气体聚合法合成 W 纳米粒子时，合成速率会持续下降，并在几分钟到几十分钟的有限时间间隔内停止。在实验中，我们注意到在氩气中加入少量氢气（5%-20%）可提高合成率，合成率在一段时间内保持不变，其值取决于注入的氢气量。质谱分析表明，在氢气存在的情况下，ArH+ 离子比 Ar+ 离子占优势，同时等离子体中 W+ 和 WH+ 物种的数量也增加了，从而使成核率大幅提高。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Plasma Chemistry and Plasma Processing 工程技术-工程：化工

CiteScore

5.90

自引率

8.30%

发文量

审稿时长

6-12 weeks

期刊介绍： Publishing original papers on fundamental and applied research in plasma chemistry and plasma processing, the scope of this journal includes processing plasmas ranging from non-thermal plasmas to thermal plasmas, and fundamental plasma studies as well as studies of specific plasma applications. Such applications include but are not limited to plasma catalysis, environmental processing including treatment of liquids and gases, biological applications of plasmas including plasma medicine and agriculture, surface modification and deposition, powder and nanostructure synthesis, energy applications including plasma combustion and reforming, resource recovery, coupling of plasmas and electrochemistry, and plasma etching. Studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces are also solicited. It is essential that submissions include substantial consideration of the role of the plasma, for example, the relevant plasma chemistry, plasma physics or plasma–surface interactions; manuscripts that consider solely the properties of materials or substances processed using a plasma are not within the journal’s scope.