{"title":"Study on carbon allotrope abrasive particles based on C60 molecule for diamond chemical mechanical polishing","authors":"Junpei Takeiri, Keisuke Suzuki, Hiroaki Iura, Taisuke Hantani, Masaki Morii, Hideaki Nisizawa","doi":"10.35848/1347-4065/ad59e9","DOIUrl":null,"url":null,"abstract":"In this study, we developed C<sub>60</sub> reactive diamond composite particles for the chemical mechanical polishing (CMP) of diamond substrates by applying the high hardness and high reactivity of the C<sub>60</sub> molecule. When diamond substrates were polished using these C<sub>60</sub> diamond composite particles, the polished surface was found to be superior to that of diamond particles. In addition, when the composite particles were irradiated with ultraviolet light to produce polishing fine particles, the polishing rate was improved by about 30%. These results indicate that the composite nanoparticles that reacted with C<sub>60</sub> have the potential to remove even the hardest of diamond substrates.","PeriodicalId":14741,"journal":{"name":"Japanese Journal of Applied Physics","volume":"82 1","pages":""},"PeriodicalIF":1.5000,"publicationDate":"2024-08-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Japanese Journal of Applied Physics","FirstCategoryId":"101","ListUrlMain":"https://doi.org/10.35848/1347-4065/ad59e9","RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"PHYSICS, APPLIED","Score":null,"Total":0}
引用次数: 0
Abstract
In this study, we developed C60 reactive diamond composite particles for the chemical mechanical polishing (CMP) of diamond substrates by applying the high hardness and high reactivity of the C60 molecule. When diamond substrates were polished using these C60 diamond composite particles, the polished surface was found to be superior to that of diamond particles. In addition, when the composite particles were irradiated with ultraviolet light to produce polishing fine particles, the polishing rate was improved by about 30%. These results indicate that the composite nanoparticles that reacted with C60 have the potential to remove even the hardest of diamond substrates.
期刊介绍：
The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP).
JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields:
• Semiconductors, dielectrics, and organic materials
• Photonics, quantum electronics, optics, and spectroscopy
• Spintronics, superconductivity, and strongly correlated materials
• Device physics including quantum information processing
• Physics-based circuits and systems
• Nanoscale science and technology
• Crystal growth, surfaces, interfaces, thin films, and bulk materials
• Plasmas, applied atomic and molecular physics, and applied nuclear physics
• Device processing, fabrication and measurement technologies, and instrumentation
• Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS
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