{"title":"A Lossy Coplanar EBG Structure for Anti-Resonance Suppression and Stopband Extension","authors":"Yuying Li;Mu-Shui Zhang;Zi-Xin Wang","doi":"10.1109/TCPMT.2024.3451621","DOIUrl":null,"url":null,"abstract":"In this article, a lossy coplanar electromagnetic bandgap (EBG) structure embedded with periodic resistors is proposed for anti-resonance suppression and stopband extension. With the aid of the resistors, anti-resonance formed by the capacitance of the unit cell and the parasitic interconnect inductance of the decoupling capacitor is mitigated, the lower cutoff frequency is shifted below 1 MHz, three orders of magnitude reduction compared to the conventional coplanar EBG structures, and two orders of magnitude reduction compared to the current stopband-enhanced coplanar EBG structures. An equivalent circuit model is developed and the effect of parameters of capacitance, inductance, and resistance of the lossy components is analyzed. To verify the effectiveness of the structure, test boards are fabricated and measured both in the high- and low-frequency ranges. Measurements and full-wave simulation results are in good agreement, showing that the proposed structure creates a stopband from 0.63 MHz to 9.91 GHz under the suppression level of −30 dB. The lower cutoff frequency falls in the effective frequency range of the lossy RC components and becomes insensitive to the bridge inductance, so the bridges between neighboring EBG cells can be shortened and widened, which will mitigate the degradation of signal integrity (SI). Eye diagram results show that the maximum eye open (MEO) has a 25% improvement by the lossy components.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":null,"pages":null},"PeriodicalIF":2.3000,"publicationDate":"2024-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10659007/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this article, a lossy coplanar electromagnetic bandgap (EBG) structure embedded with periodic resistors is proposed for anti-resonance suppression and stopband extension. With the aid of the resistors, anti-resonance formed by the capacitance of the unit cell and the parasitic interconnect inductance of the decoupling capacitor is mitigated, the lower cutoff frequency is shifted below 1 MHz, three orders of magnitude reduction compared to the conventional coplanar EBG structures, and two orders of magnitude reduction compared to the current stopband-enhanced coplanar EBG structures. An equivalent circuit model is developed and the effect of parameters of capacitance, inductance, and resistance of the lossy components is analyzed. To verify the effectiveness of the structure, test boards are fabricated and measured both in the high- and low-frequency ranges. Measurements and full-wave simulation results are in good agreement, showing that the proposed structure creates a stopband from 0.63 MHz to 9.91 GHz under the suppression level of −30 dB. The lower cutoff frequency falls in the effective frequency range of the lossy RC components and becomes insensitive to the bridge inductance, so the bridges between neighboring EBG cells can be shortened and widened, which will mitigate the degradation of signal integrity (SI). Eye diagram results show that the maximum eye open (MEO) has a 25% improvement by the lossy components.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.