3-D-Conformable Conductive Composite Film for Printed Circuit Board Level Electromagnetic Interference Shielding

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-08-29 DOI:10.1109/TCPMT.2024.3451730

Dingkun Tian;Fukang Deng;Yong Wang;Yadong Xu;Zhiqiang Lin;Mujiu Chen;Guoping Zhang;Yougen Hu;Rong Sun

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Abstract

With the progressive demands of electronics, advanced electromagnetic interference (EMI) shielding technology are desired to protect electronics against risk from EMI radiation under various conditions. In this work, a new kind of 3-D conformal EMI shielding technology based on a polymer composite film with high stretchability and electrical conductivity was proposed. The conductive composite film contains thermal plastic polymer matrix, metallic fillers, and additives, which exhibits excellent conductive, stretchable, and adhesive properties, and provides 3-D conformable capability on a printed circuit board assembly (PCBA). The conductive composite film shows a high EMI shielding effectiveness (SE) value of 72 dB in the 30–3000 MHz and 91 dB in the 8.2–12.4 GHz at thickness of

$65~\mu $

m, and relative near-field SE value of exceed 35 dB in 500–6000 MHz. Obviously, this novel conformal EMI shielding technology will be a promising candidate for application in board-level shielding (BLS).

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用于印刷电路板级电磁干扰屏蔽的三维可成型导电复合膜

随着对电子产品要求的不断提高，人们需要先进的电磁干扰（EMI）屏蔽技术来保护电子产品在各种条件下免受 EMI 辐射的危害。本研究提出了一种基于高拉伸性和导电性聚合物复合膜的新型三维保形 EMI 屏蔽技术。这种导电复合膜包含热塑料聚合物基体、金属填料和添加剂，具有优异的导电性、可拉伸性和粘合性，可在印刷电路板组件（PCBA）上实现三维保形。在厚度为 65~\mu $ m 时，该导电复合膜在 30-3000 MHz 和 8.2-12.4 GHz 的电磁干扰屏蔽效能（SE）值分别为 72 dB 和 91 dB，在 500-6000 MHz 的相对近场 SE 值超过 35 dB。显然，这种新型保形 EMI 屏蔽技术将有望应用于板级屏蔽（BLS）。

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

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