GNN-SP: Fast S-Parameter Estimation of Chiplet Interconnect via Graph Neural Network

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-08-26 DOI:10.1109/TCPMT.2024.3449330
Lihao Liu;Yunhui Li;Beisi Lu;Li Shang;Fan Yang
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Abstract

A chiplet-based heterogeneous integrated system design has emerged as a new trend in advanced packaging. However, the high density and complexity of high-speed interconnects between chiplets introduce significant signal integrity (SI) challenges. Rapid and accurate assessment of SI during the design stage is critical to ensure the functionality and performance of chiplet-based systems. Traditional numerical methods for evaluating SI, such as the method of moments (MoM), face challenges due to their substantial demands on computing time and hardware resources. This work presents GNN-SP, a novel graph neural network (GNN)-based method for rapid S-parameter estimation of chiplet interconnects, as well as an open dataset for chiplet interconnect SI based on the Universal Chiplet Interconnect Express (UCIe) standard. GNN is capable of capturing different combinations of local interconnect patterns through message passing, and in GNN-SP, global information is encoded into graph nodes to be incorporated into the node aggregation process. Therefore, the GNN model is able to learn both global and intricate local information of complex interconnects. Compared with convolutional neural networks (CNNs) and multilayer perceptron (MLP)-based methods for predicting the magnitude and phase of S-parameters, GNN-SP reduces the average relative error from 70% to 90% and achieves a speedup of $1.3{\times }$ $9.97{\times }$ . Compared with the commercial Agilent advanced design system (ADS) Momentum simulator based on the MoM, GNN-SP achieves a speedup of 22 $099{\times }$ with an average relative error below 1.93% for insertion/return loss and an average relative error below 3.31% for crosstalk.
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GNN-SP:通过图神经网络快速估计芯片互连的 S 参数
基于芯片的异构集成系统设计已成为先进封装的新趋势。然而,芯片间高速互连的高密度和复杂性带来了巨大的信号完整性(SI)挑战。在设计阶段快速、准确地评估 SI 对于确保芯片系统的功能和性能至关重要。用于评估 SI 的传统数值方法(如矩法 (MoM))因其对计算时间和硬件资源的大量需求而面临挑战。本研究提出了一种基于图神经网络(GNN)的新方法 GNN-SP,用于快速估算芯片互连的 S 参数,以及基于通用芯片互连 Express(UCIe)标准的芯片互连 SI 开放数据集。GNN 能够通过消息传递捕捉本地互连模式的不同组合,而在 GNN-SP 中,全局信息被编码到图节点中,以纳入节点聚合过程。因此,GNN 模型能够学习复杂互连的全局信息和错综复杂的局部信息。与基于卷积神经网络(CNN)和多层感知器(MLP)的 S 参数幅值和相位预测方法相比,GNN-SP 将平均相对误差从 70% 降低到 90%,速度提高了 1.3{times }$ - 9.97{times }$。与基于 MoM 的商用安捷伦高级设计系统 (ADS) Momentum 仿真器相比,GNN-SP 的速度提高了 22 $099{/times }$,插入/回波损耗的平均相对误差低于 1.93%,串扰的平均相对误差低于 3.31%。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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