The Effect of Corrosion on the Electrical Contact Performance of Aviation Connectors Revealed by In Situ Impedance Measurements

IF 3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-08-23 DOI:10.1109/TCPMT.2024.3448431
Gang Zhang;Yin Shi;Xin He;Xiao Chen;Alistair Duffy;Meng Zhu;Zhuowei Han;Lixin Wang
{"title":"The Effect of Corrosion on the Electrical Contact Performance of Aviation Connectors Revealed by In Situ Impedance Measurements","authors":"Gang Zhang;Yin Shi;Xin He;Xiao Chen;Alistair Duffy;Meng Zhu;Zhuowei Han;Lixin Wang","doi":"10.1109/TCPMT.2024.3448431","DOIUrl":null,"url":null,"abstract":"This work proposes a new method to evaluate the electrical contact performance of aviation connectors by in situ measurement of broadband impedance. The broadband impedance of the wire connector under corrosive environments is measured using an inductively coupled measurement scheme, which can be conducted under operating conditions. By observing variations in the inductance and resonant frequency of measured impedance, the degradation of the connectors can be assessed more accurately and intuitively. Experiments reveal a quasi-linear degradation correspondence between the impedance of connectors and corrosion duration. Moreover, the impedance of connectors is more sensitive to corrosion-induced degradation compared to resistance, which means that potential damage to the connector can be detected earlier through the proposed in situ impedance measurement, allowing for better-informed risk management and timely repair or replacement, particularly in safety-critical situations.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"140-149"},"PeriodicalIF":3.0000,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10644070/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

This work proposes a new method to evaluate the electrical contact performance of aviation connectors by in situ measurement of broadband impedance. The broadband impedance of the wire connector under corrosive environments is measured using an inductively coupled measurement scheme, which can be conducted under operating conditions. By observing variations in the inductance and resonant frequency of measured impedance, the degradation of the connectors can be assessed more accurately and intuitively. Experiments reveal a quasi-linear degradation correspondence between the impedance of connectors and corrosion duration. Moreover, the impedance of connectors is more sensitive to corrosion-induced degradation compared to resistance, which means that potential damage to the connector can be detected earlier through the proposed in situ impedance measurement, allowing for better-informed risk management and timely repair or replacement, particularly in safety-critical situations.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
通过现场阻抗测量揭示腐蚀对航空连接器电气接触性能的影响
本文提出了一种利用宽带阻抗原位测量来评价航空连接器电接触性能的新方法。采用可在工作条件下进行的电感耦合测量方案,对腐蚀环境下导线连接器的宽带阻抗进行了测量。通过观察被测阻抗的电感和谐振频率的变化,可以更准确、直观地评估连接器的退化情况。实验揭示了连接器阻抗与腐蚀持续时间之间的准线性退化对应关系。此外,与电阻相比,连接器的阻抗对腐蚀引起的退化更敏感,这意味着可以通过提出的原位阻抗测量更早地检测到连接器的潜在损坏,从而实现更好的风险管理和及时修复或更换,特别是在安全关键情况下。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
期刊最新文献
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information 2025 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 15 IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1