Xinyu Zhang;Jun Li;Chenglin Yang;Tiancheng Liang;Wenwen Zhang;Yang Yang
{"title":"A Wideband Dual-Polarized Antenna-in-Package for 5G Millimeter-Wave User Equipment","authors":"Xinyu Zhang;Jun Li;Chenglin Yang;Tiancheng Liang;Wenwen Zhang;Yang Yang","doi":"10.1109/TCPMT.2024.3447650","DOIUrl":null,"url":null,"abstract":"This article presents a broadband dual-polarization antenna-in-package (AiP) design for 5G millimeter-wave user equipment. The magnetoelectric (ME) antenna is adopted to achieve dual polarization and broadband. We introduce a tapered feeding probe to enhance the antenna’s dual-polarization isolation and optimize the impedance matching between the feeding network and the radiating patch to achieve high gain throughout the entire operating bandwidth. Based on the antenna element, we design a \n<inline-formula> <tex-math>$1\\times 4$ </tex-math></inline-formula>\n antenna array with the dimensions of \n<inline-formula> <tex-math>$20\\times 5\\times 1.1$ </tex-math></inline-formula>\n mm3. The impedance bandwidth of both polarizations of the array falls within 26.8–42.7 GHz, covering the majority of the 5G new radio (NR) bands. The gain range for horizontal polarization within this band is 9.87–12.5 dBi, while that for vertical polarization is 10.67–12.51 dBi. The antenna array can achieve the beam-scanning angles of 50° and 30° in the FR2 n257 and n260 frequency bands, respectively. The AiP is manufactured and tested using the flip-chip ball grid array (FCBGA) process on an organic substrate, with the test results closely aligning with simulation outcomes. The proposed AiP covers 5G millimeter-wave n257, n259, n260, and n261 bands and a significant portion of n258 (24.25–27.5 GHz) while guaranteeing high dual-polarization isolation and considerable gain, thus making it suitable for application in 5G millimeter-wave user equipment.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 10","pages":"1845-1853"},"PeriodicalIF":2.3000,"publicationDate":"2024-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10643615/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This article presents a broadband dual-polarization antenna-in-package (AiP) design for 5G millimeter-wave user equipment. The magnetoelectric (ME) antenna is adopted to achieve dual polarization and broadband. We introduce a tapered feeding probe to enhance the antenna’s dual-polarization isolation and optimize the impedance matching between the feeding network and the radiating patch to achieve high gain throughout the entire operating bandwidth. Based on the antenna element, we design a
$1\times 4$
antenna array with the dimensions of
$20\times 5\times 1.1$
mm3. The impedance bandwidth of both polarizations of the array falls within 26.8–42.7 GHz, covering the majority of the 5G new radio (NR) bands. The gain range for horizontal polarization within this band is 9.87–12.5 dBi, while that for vertical polarization is 10.67–12.51 dBi. The antenna array can achieve the beam-scanning angles of 50° and 30° in the FR2 n257 and n260 frequency bands, respectively. The AiP is manufactured and tested using the flip-chip ball grid array (FCBGA) process on an organic substrate, with the test results closely aligning with simulation outcomes. The proposed AiP covers 5G millimeter-wave n257, n259, n260, and n261 bands and a significant portion of n258 (24.25–27.5 GHz) while guaranteeing high dual-polarization isolation and considerable gain, thus making it suitable for application in 5G millimeter-wave user equipment.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.