{"title":"A DC-43.5 GHz Wire-Bonding and Vertical Via Interconnection by Embedded Nonuniform Elliptical Technique for 3-D System in Package","authors":"Pei Ge;Hao-Ran Zhu;Jia-Guo Lu","doi":"10.1109/TCPMT.2024.3442828","DOIUrl":null,"url":null,"abstract":"In this article, a novel ultrawide wire-bonding and vertical via interconnection are proposed for 3-D system in package (SiP) by embedded nonuniform elliptic technique. The vertical compensation structure of the bonding wires is constructed by an elliptic capacitive stripline with a series inductance short via. For vertical via interconnection, the elliptical slot is employed to act as a seventh-order low-pass filter with the quasi-coaxial structure, which is formed by the signal hole surrounded by several grounded holes. The impedance fluctuation is significantly reduced by gradually changing the width of the elliptic structure. The coupling between the adjacent wires is added to build the equivalent circuit model, which can accurately analyze the transmission behavior of the wire-bonding interconnection. From the measurement results, the return loss is better than 15 dB and the insertion loss is less than 1 dB within the frequency range of dc-43.5 GHz.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":null,"pages":null},"PeriodicalIF":2.3000,"publicationDate":"2024-08-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10634530/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this article, a novel ultrawide wire-bonding and vertical via interconnection are proposed for 3-D system in package (SiP) by embedded nonuniform elliptic technique. The vertical compensation structure of the bonding wires is constructed by an elliptic capacitive stripline with a series inductance short via. For vertical via interconnection, the elliptical slot is employed to act as a seventh-order low-pass filter with the quasi-coaxial structure, which is formed by the signal hole surrounded by several grounded holes. The impedance fluctuation is significantly reduced by gradually changing the width of the elliptic structure. The coupling between the adjacent wires is added to build the equivalent circuit model, which can accurately analyze the transmission behavior of the wire-bonding interconnection. From the measurement results, the return loss is better than 15 dB and the insertion loss is less than 1 dB within the frequency range of dc-43.5 GHz.
期刊介绍：
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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