Investigation on the microstructure, mechanical properties and chlorine resistance of fine aluminum alloy wires

Abstract

Wire bonding is a fundamental and mature technology in semiconductor packaging process, primarily using materials such as gold, silver, aluminum, and copper for the wires. To address application limitations of aluminum wires, such as low electromigration resistance and limited ductility, techniques including to enhance alloying (with Zn and Si), heat treatment, and surface treatment are employed to enhance the performance of aluminum alloy wires and broaden their application value. This study selects Al-3Zn-0.3Si (AZS303) and Al-7Zn-0.3Si (AZS703), with AZS303 undergoing gold plating to produce AC-AZS303 wires. Various high-temperature heat treatments are applied, verifying that under 400 °C conditions, the AZS series aluminum alloy wires exhibit grain growth and form single-crystal equiaxed grain structures, resulting in stable mechanical properties and excellent electrical performance. Additionally, the AC-AZS303 wires optimize resistance values through gold layer diffusion induced by the electrothermal effect.

Chlorine experiments indicates that the gold plating on AC-AZS303 can't enhance the aluminum wire's resistance to chlorine corrosion. However, the alloying effect of zine and silicon elements imparts excellent chlorine corrosion resistance to the Al-Zn-Si wires. This study of bonding properties examines the bond strength and observes the bonded area of Al-Zn-Si wires after bonding. It is noted that the H400-AZS303 wire exhibits the best bond strength and bonding area, demonstrating good bonding with the substrate.