A novel ZnO/FeOCl composite as a photo-Fenton catalyst for degradation tetracycline under visible light

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2024-09-18 DOI:10.1007/s10854-024-13497-1

Qingsong Yu, Zhiming Li, Zhiqiang Wei, Meijie Ding, Huining Zhang

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Abstract

A series of novel ZnO/FeOCl photo-Fenton catalysts were prepared using a simple calcination method. These composite catalysts were evaluated for tetracycline (TC) degradation under simulated sunlight. The photo-Fenton tests revealed that the ZnO/FeOCl composite catalysts exhibited higher activity than pure FeOCl due to the presence of ZnO. Specifically, the degradation of TC by 20% ZnO/FeOCl reached 93.9% in 60 min, which was attributed to the formation of an n–n heterojunction between ZnO and FeOCl that enhanced the separation efficiency of photogenerated electron–hole pairs. Additionally, the TC removal efficiency remained at 84.4% after four cycles, indicating good structural stability of the composite catalyst. A proposed mechanism for TC degradation by ZnO/FeOCl catalysts, based on free radical trapping experiments, suggested that hydroxyl radicals (·OH) were the primary active species. This study provides new insights into the synthesis of photo-Fenton catalysts and the efficient treatment of antibiotic-contaminated wastewater.

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新型 ZnO/FeOCl 复合材料作为光 Fenton 催化剂在可见光下降解四环素

采用简单的煅烧方法制备了一系列新型 ZnO/FeOCl 光芬顿催化剂。在模拟阳光下对这些复合催化剂进行了四环素（TC）降解评估。光-芬顿测试表明，由于 ZnO 的存在，ZnO/FeOCl 复合催化剂比纯 FeOCl 具有更高的活性。具体来说，20% ZnO/FeOCl 对三氯甲烷的降解率在 60 分钟内达到 93.9%，这归因于 ZnO 和 FeOCl 之间形成了 n-n 异质结，提高了光生电子-空穴对的分离效率。此外，经过四个循环后，三氯甲烷的去除率仍保持在 84.4%，这表明复合催化剂具有良好的结构稳定性。根据自由基捕获实验提出的 ZnO/FeOCl 催化剂降解三氯甲烷的机理表明，羟基自由基（-OH）是主要的活性物种。这项研究为光 Fenton 催化剂的合成和抗生素污染废水的高效处理提供了新的思路。

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.